R mPGA604 Socket Mechanical Design Guide March 2005 Document Number: 254239-002
R INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT.
R Contents 1 Introduction ....................................................................................................................... 7 1.1 Objective ................................................................................................................ 7 1.2 Purpose.................................................................................................................. 7 1.3 Scope ...............................................................................................
R 5.2 5.3 Solvent Resistance .............................................................................................. 28 Durability .............................................................................................................. 28 6 Validation Testing Requirements .................................................................................. 29 6.1 Applicable Documents ......................................................................................... 29 6.
R Revision History Revision Number 001 002 Description • • Initial release of the document. ® Updated for 2005 Intel Xeon™ products. Date October 2003 March 2005 Note: Not all revisions may be published.
R Re-Validation Notice to Socket Vendors Any significant change to the socket will require submission of a detailed explanation of the change at least 60 days prior to the planned implementation. Intel will review the modification and establish the necessary re-validation procedure that the socket must pass. Any testing that is required MUST be completed before the change is implemented.
R 1 Introduction 1.1 Objective This document defines a surface mount, Zero Insertion Force (ZIF) socket intended for workstation and server platforms based on Intel microprocessors. The socket provides I/O, power and ground contacts. The socket contains 604 contacts arrayed about a cavity in the center of the socket with solder balls/surface mount features for surface mounting with the motherboard. The mPGA604 Socket contacts have 1.
R Introduction 8 mPGA604 Socket Mechanical Design Guide
R 2 Assembled Component and Package Description The mPGA604 socket dimensions and characteristics must be compatible with that of the processor package and related assembly components. Processors using flip-chip pin grid array (FC- mPGA4) package technology are targeted to be used with the mPGA604 socket. The assembled component may consist of a cooling solution (heatsink, fan, and retention mechanism), and processor package.
R Assembled Component and Package Description 10 mPGA604 Socket Mechanical Design Guide
R 3 Mechanical Requirements 3.1 Attachment A retention system needs to isolate any load in excess of 222.41 N, compressive, from the socket during the shock and vibration conditions outlined in Section 5. The socket must pass the mechanical shock and vibration requirements listed in Section 5 with the associated heatsink and retention mechanism attached. Socket can only be attached by the 603 contacts to the motherboard. No external (i.e. screw, extra solder, adhesive....
R Mechanical Requirements 3.5 Markings All markings required in this section must be able to withstand a temperature of 240 ºC for 40 seconds (minimum) typical of a reflow profile for solder material used on the socket, as well as any environmental test procedure outlined in Section 5. 3.5.1 Name mPGA604 (Font type is Helvetica Bold – minimum 6 point). This mark shall be molded or Laser Marked into the processor side of the socket housing. Manufacturer’s insignia (font size at supplier’s discretion).
R Mechanical Requirements 3.7 Socket/Package Translation During Actuation The socket shall be built so that the post-actuated package pin field displacement will not exceed 1.27 mm. Movement will be along the Y direction. No Z-axis travel (lift out) of the package is allowed during actuation. 3.8 Orientation in Packaging, Shipping and Handling Packaging media needs to support high volume manufacturing. 3.9 Contact Characteristics 3.9.1 Number of contacts Total number of contacts: 603.
R Mechanical Requirements CFCs and HFCs shall not be used in manufacturing the socket. It is recommended that any plastic component exceeding 25g must be recyclable as per the European Blue Angel recycling design guidelines. 3.11 3.12 Lever Actuation Requirements • Lever closed direction—right. • Actuation direction called out in Section 9. • 135º lever travel max. • Pivot point in the center of the actuation area on the top of the socket. Section 9.
R Mechanical Requirements maintain Critical Process Parameters controlling these CTFs or will provide direct measurements to meet ongoing quality requirements. Table 3-1.
R Mechanical Requirements 16 mPGA604 Socket Mechanical Design Guide
R 4 Electrical Requirements Socket electrical requirements are measured from the socked-seating plane of the processor test vehicle (PTV) to the component side of the socket PCB to which it is attached. All specification are maximum values (unless otherwise stated) for a single socket pin, but includes effects of adjacent pins where indicated. Pin and socket inductance includes exposed pin from mated contact to bottom of the processor pin field. Table 4-1.
R Electrical Requirements Table 4-2. Definitions (Sheet 2 of 2) 4.1 4 Maximum Average Contact Resistance. Refer to Table 4-1, Item 4 The max average resistance target is originally derived from max resistance of each chain minus resistance of shorting bars divided by number of pins in the daisy chain. This value has to be satisfied at all time. Thus, this is the spec valid at End of Line, End of Life and etc.
R Electrical Requirements Figure 4-3 shows the resistance test fixtures separately and superimposed. The upper figure is the package. The next figure is the baseboard. There are 48 daisy chain configurations on resistance test board. The bottom figure is the two parts superimposed. Table 4-3 shows these configurations with the number of pins per each chain and netlist. Figure 4-3.
R Electrical Requirements 20 mPGA604 Socket Mechanical Design Guide
R Electrical Requirements Table 4-3.
R Electrical Requirements Table 4-3. Resistance Test Fixture Netlist (Sheet 2 of 2) DC Endpoints 4.
R Electrical Requirements 4.3 Inductance The bottom fixture for the inductance measurement is a ground plane on the secondary side of the motherboard with all pins grounded. The component side of the socket PCB does not contain a plane. The top fixture is the package, which contains pins that will connect to the socket. Figure 4-4 shows the inductance measurement fixture cross-section and the inductance measurement methodology. The first figure shows the entire assembly.
R Electrical Requirements 4.3.1 Design Procedure for Inductance Measurements The measurement equipment required to perform the validation is: • Equipment - HP8753D Vector Network Analyzer or equivalent. • Robust Probe Station (GTL4040) or equivalent. • Probes - GS1250 & GSG1250 Air-Co-Planar or equivalent. • Calibration – Cascade Calibration Substrates or equivalent. • Measurement objects - Sockets, Motherboards. Measurement Steps: 1. Equipment Setup: a.
R Electrical Requirements 4.3.2 Correlation of Measurement and Model Data Inductance To correlate the measurement and model data for loop inductance, one unit of measured socket assembly (socket and shorted test fixture) and one unit of measured sandwich (shorted test fixture) will be chosen for cross sectioning. Both units will be modeled based on data from cross sectioning using Ansoft* 3D. The sandwich inductance will be subtracted from socket assembly inductance for both measured and modeled data.
R Electrical Requirements Table 4-4.
R 5 Environmental Requirements Design, including materials, shall be consistent with the manufacture of units that meet the following environmental reference points. The reliability targets in this section are based on the expected field use environment for a desktop product. The test sequence for new sockets will be developed using the knowledge-based reliability evaluation methodology, which is acceleration factor dependent. A simplified process flow of this methodology can be seen in Figure 5-1.
R Environmental Requirements 5.1 Mixed Flowing Gas Test will be defined in a future revision of this document. 5.2 Solvent Resistance Requirement: No damage to ink markings if applicable. EIA 364-11A 5.3 Durability Use per EIA-364, test procedure 09. Measure contact resistance when mated in 1st and 30th cycles. The package should be removed at the end of each de-actuation cycle and reinserted into the socket.
R 6 Validation Testing Requirements This section of the document outlines the tests that must be successfully completed in order for the supplier’s socket to pass the design guidelines validations. It provides the test plan and procedure required for validation. 6.1 Applicable Documents • EIA-364-C • Applicable processor Datasheet* • Applicable processor Thermal Design Guidelines Documents* Note: *For details on ordering this document, contact your Intel field sales representative. 6.
R Validation Testing Requirements Typical examples of significant changes include, but are not limited to, the following: Plastic material changes including base material or color; contact changes including base material, plating material or thickness; and design modifications. 6.7 Quality Assurance Requirements The OEM’s will work with the socket supplier(s) they choose to ensure socket quality. 6.8 Socket Test Plan 6.8.
R 7 Safety Requirements Design, including materials, shall be consistent with the manufacture of units that meet the following safety standards: • UL 1950 most current editions. • CSA 950 most current edition. • EN60 950 most current edition and amendments. • IEC60 950 most current edition and amendments.
R Safety Requirements 32 mPGA604 Socket Mechanical Design Guide
R 8 Documentation Requirements The socket supplier shall provide Intel with the following documentation: • Multi-Line Coupled SPICE models for socket. • Product design guidelines incorporating the requirements of these design guidelines. • Recommended board layout guidelines for the socket consistent with low cost, high volume printed circuit board technology.
R Documentation Requirements 34 mPGA604 Socket Mechanical Design Guide
R 9 Mechanical Drawings These drawings refer to the mPGA604 socket. Note: Intel reserves the right to make changes and modifications to the design as necessary. Note: Figures may not be to scale. Figure 9-1.
R Mechanical Drawings Figure 9-2.
R Mechanical Drawings Figure 9-3.
R Mechanical Drawings Figure 9-4.
R Mechanical Drawings Figure 9-5.
R Mechanical Drawings Figure 9-6.
R Mechanical Drawings Figure 9-7.
R Mechanical Drawings Figure 9-8.
R Mechanical Drawings Figure 9-9.
R Mechanical Drawings Figure 9-10.
R Mechanical Drawings mPGA604 Socket Mechanical Design Guide 45
