Data Sheet

ISM14585-L35 Specification
DOC-DS-14585-201807-3.0
Confidential Inventek Systems
Page 95
11 Recommend Footprint (Board Design)
11.1 Module Dimension Measurement
Unit: mm
TOP View
Note:
• Please use Un-Solder Mask to design the Module Footprint.
• There are two types pad size in the Module.
o Rectangle : Pad size: 0.3 x 0.5 mm & Solder Mask size: 0.375 x 0.575 mm
o Circle: Pad size (Φ): 0.5 mm & Solder Mask size (Φ): 0.6 mm
• Please contact Inventek Systems for interest in a chip-down design.