Data Sheet

ISM4343 Specification
DOC-DS-20074-5.3
Inventek Systems
Page 3
11.1 Application Circuit – Single Antenna ........................................................................... 41
11.2 ISM4343-WBM-L151 Application Circuit –Power Supply ......................................... 42
12 ISM4343-WBM-L151 DC POWER CONDITIONING AND DISTRIBUTION ................ 42
12.1 Power Conditioning ...................................................................................................... 42
13 ISM4343-WBM-L151 PCB LAYOUT GUIDELINES........................................................ 43
13.1 DC Power ...................................................................................................................... 43
13.2 Antenna port RF signal ................................................................................................. 43
14 ISM4343-WBM-L151 Mechanical Specification................................................................. 44
14.1 ISM4343-WBM-L151 Recommended PCB Footprint ................................................. 45
(Bottom View) .......................................................................................................................... 45
14.2 ISM4343-WBM-L151 Recommended PCB Footprint (Top View) ............................. 46
14.3 ISM4343-WBM-L151 Recommend Stencil: Unit: mm ............................................... 51
15 ISM4343-WBM-L54 Mechanical Specifications ................................................................. 52
15.1 ISM4343-WBM-L54 Dimensions top view (mm) ....................................................... 52
15.2 ISM4343-WBM-L54 Module’s Dimensions Top View (mm) .................................... 52
16 ISM4343-WBM-L54 Antenna Keep-Out Area .................................................................... 53
17 On Board OTA Flash ........................................................................................................... 53
17 Product Compliance Considerations ..................................................................................... 54
18 ISM4343-WBM-L151 Reflow Profile .................................................................................. 54
19 ISM4343-WBM-L54 Reflow Profile .................................................................................... 55
20 Packaging Information .......................................................................................................... 56
20.1 MSL Level / Storage Condition .................................................................................... 56
20.2 Device baking requirements prior to assembly ............................................................. 56
21 REVISION CONTROL ......................................................... Error! Bookmark not defined.
22 CONTACT INFORMATION ............................................................................................... 57