Data Sheet

ISM4343 Specification
DOC-DS-20074-5.3
Inventek Systems
Page 44
• Clear internal layer (or layers) of metal. This improves micro-strip, CGW, and strip-line
geometries, allowing wider traces.
• Fill the areas along both sides of traces with ground to improve isolation, but provide adequate
clearance to minimize co-planar capacitance and leakage. These ground-filled areas are integral
to CGW designs.
• Use several ground vias along both sides of the signal traces to connect RF ground-fill areas to
the internal RF ground plane.
• Avoid crossing RF traces if possible.
14 ISM4343-WBM-L151 Mechanical Specification
The following paragraphs provide the requirements for the size, weight.
The size and thickness of the ISM4343-WBM-L151 Module is 10mm (W) x 10mm (L) x 1.2mm (H):
(Tolerance: +/- 0.1mm)
Mechanical Dimension
Dimension: 10 x 10 x 1.2 mm3