Data Sheet

ISM4343 Specification
DOC-DS-20074-5.3
Inventek Systems
Page 56
20 Packaging Information
20.1 MSL Level / Storage Condition
20.2 Device baking requirements prior to assembly
Boards must be baked prior to rework or assembly to avoid damaging moisture sensitive
components during localized reflow. The default bake cycles is 24 hours at 125C.
Maintaining proper control of moisture uptake in components is critical.
Before opening the shipping bag and attempting solder reflow, you should maintain a
minimal out-of-bag time and ensure the highest possible package reliability for the final
product.