User's Manual

SECTION 4: FACTORY TEST PROCEDURE
M64700G25-FCCRpt.doc Page 30
The x=1400,19 command will generate different messages with differing DC components.
Each message will slightly slew the frequency off from the center frequency). Be careful to
closely monitor the variation in transmit frequency due to these different messages and
ensure that on average the transit frequency error has been minimized to within +/-100 Hz.
This indicates that some of these test messages will be slightly high in frequency, some
messages will be slightly low in frequency, and some messages will be right on frequency.
Step 4 Verify the transmit deviation is 4.9 kHz
Step 5 Verify the timing characteristics are identical to the plots in the next section, Uplink
Hardware Timing Verification.
Step 6 At the base station monitor PC, verify that all the data quality readings are 240 and higher.
Step 7 Move the scope probes to monitor the timing at the mobile radio as described in Downlink
Hardware Timing Verification. Generate test messages by issuing a ping command to the
IPNC from the PC attached to the radio. The following command will cause 100 pings, 500
bytes in length to be transmitted from the mobile radio and echoed by the IPNC through the
base station:
.>;Ping 192.168.3.3 -n 100 -l 500 -w 2000
Step 8 Set CRC =1 Enable on the radio
Step 9 Verify the timing characteristics are identical to those in Downlink Hardware Timing
Verification.
Step 10 Verify that both receivers on the mobile radio report data quality readings of 240 or higher
(248 is typical). This can be accomplished by installing the antenna on the TX/RX1 port and
verifying RX1 is selected by observing the RX1 LED on the mobile radio and installing the
antenna on the RX2 port and verifying RX2 is selected by observing the RX2 LED on the
mobile radio.
Step 11 Reset CRC = 0 Disable on the radio
Step 12 In IPMessage, type the ? command to radio. Copy the radio settings and paste them into the
Test Data File.
Step 13 Perform a close visual inspection of the radio closely inspecting manufacturing related
problems (loose screws, solder particles, etc.).