User Manual

7.1 GENERAL DATA
Flip the µCROS SL, hold the housing on the ESD mat and lift the POWER/CAN/IO connector
until the PBC below the heat sink clears the housing on the side of the POWER/CAN/IO
connector.
Then pull on the POWER/CAN/IO connector until the SMA connectors cleared the holes in
the housing and lift the heat sink up until housing and heat sink/PCB assembly separate.
Put the housing aside for later reassembly and place the heat sink/PCB assembly with the
PCB facing up on the ESD mat. The SIM card holder can be found on the UMTS daugh-
terboard on top of the assembly. Open it by pushing the locking bar labeled ”push to
open”.
Attention:
Take care not to bend or break the EMC fingers (EMCFs) of the µCROS
SL.
Changes and errors excepted. µCROS SL V1.10 EN - 2020/03 23