Assembly Instructions

GHZ BGA Socket (surface mount)
Assembly Instructions
© 2000 IRONWOOD ELECTRONICS, INC.
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www.ironwoodelectronics.com
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Preheat
Flux Activation
Reflow Cool-Down
<2°C
per Second
150 - 180 Seconds
<2°C
per Second
1° to 3°C
per Second
Time (seconds)
Temperature (°C)
Maximum Package Body Temperature
Solder Temperature Melting Point
Recommended Reflow Profile
1. Use caution when profiling to insure minimal temperature difference (<15 C and preferably <10 C) between components
2. Forced convection reflow with nitrogen preferred (optional)
3. Preheat stage temperature ramp rate: <2 C per second
4. Time required in Flux Activation stage: 150 to 180 seconds
5. Flux Activation stage temperature range: 150 to 183 C
6. Time required in Solder stage: 60 seconds
7. Maximum temperature 210 - 220 C (Do not exceed 10 seconds at maximum temperature)
8. Cool-Down stage temperature reduction rate: <2 C per second
NOTE:
It may be necessary to adjust the amount of heat when attaching the part, due to the fact that
the adapter mass is different from the actual IC package. Solder sphere spec = 63Sn, 37Pb
and its melting point = 183 C
Filename: HSI.mcd, Rev A, 1/18/00, IP