instructions User guide

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Giga-snaP™ & BGA Surface Mount Foot Soldering Instructions
Target PCBs, which are intended to accept the
Ironwood Electronics BGA surface mount
emulator foot can vary greatly in size, mass, and
thickness. There are also several manufacturing
processes that can be used to attach the BGA
surface mount emulator feet to target PCBs.
Because of these wide ranges in customer target
PCB specifications and process scenarios,
Ironwood Electronics can offer only general
soldering instructions.
Ironwood's BGA surface mount emulator foot
closely emulates a BGA package and therefore
can employ similar processes to attach it to a
target board. The recommended method is
explained below with visual aids showing the
step-by-step process. This method has
produced very good results. Figure 1 shows the
BGA surface mount emulator foot and a clean
target printed circuit board. The bottom side of the
surface mount foot (shown) contains solder
spheres. The steps involved in the soldering
process are as follows:
(1) Using a flux dispenser, place a small amount of
flux (water soluble or no clean) on the middle of
the target PCB lands as shown in Figure 2. Spread
the flux evenly over the PCB lands.
(2) Apply a small amount of TAC flux on opposite
corners of the PCB lands as shown in Figure 3.
(3) Note the target board land pattern orientation
and the adapter Pin 1 location. Place the adapter (sphere side down) onto the flux and land pattern
as shown in Figure 4 (align as closely as possible to the land pattern of the target PCB). The
BGA surface mount feet are durable enough to be handled by hand. However, adaptors are
available for handling the part with a vacuum pen or pick and place equipment.
Figure 1: Target PCB/BGA Emulator Foot
Figure 2: Applying Flux
Figure 3: Align Adapter to Target PCB
Figure 4: Placing Tac Flux