Stamped Spring Pin Socket for Burn-in & Test Applications User Manual
Tel: (800) 404-0204 www.ironwoodelectronics.com STAMPED SPRING PIN SOCKET USER MANUAL Table of Contents Socket Mechanics ......................................................................................................................................... 2 Selecting a BGA Stamped pin socket ......................................................................................................... 2 PCB Requirements...........................................................................................
Tel: (800) 404-0204 www.ironwoodelectronics.com Socket Mechanics SBT-BGA sockets provide high bandwidth in a small, cost effective ZIF socket for prototype, test and burn-in applications. SBT-BGA socket is a simple, mechanical socket based on stamped spring pin technology. SBTBGA socket is a solder-less socket that can be mounted on to a PCB using supplied hardware. The PCB should have mounting and alignment holes at proper locations (see page 2 of the drawing for recommended PCB layout information).
Tel: (800) 404-0204 www.ironwoodelectronics.com 3. Maximum solder ball diameter of IC should be less than or equal to that shown in the table. 4. Maximum and minimum solder ball height should fall within the range shown in the table. If any of the above parameters do not match, please call Ironwood Tech Support @1-800-404-0204 to help select a socket (which may currently be in development). PCB Requirements Please refer to page 2 of the socket drawing for all PCB recommendations.
Tel: (800) 404-0204 www.ironwoodelectronics.com 5. Turn the compression screw clockwise, until it makes contact with the compression plate and/or the BGA package. 6. Turn the compression screw further so that BGA balls are compressed on the spring pins to make contact. When turning becomes hard, full compression is achieved. Internal stops will prevent over compression when turned by hand.
Tel: (800) 404-0204 www.ironwoodelectronics.com Backing and insulation Plate For all IC body sizes, stamped pin sockets require a rigid metal backing plate to prevent deflection of the target circuit board due to a high normal force required to compress the stamped pins. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed.
Tel: (800) 404-0204 www.ironwoodelectronics.com 0.4mm Center – BGA Stamped Contact Specification (Scale 40:1) 0.4mm Center – LGA Stamped Contact Specification (Scale 40:1) 6|Page SBT.doc, Rev.
Tel: (800) 404-0204 www.ironwoodelectronics.com 0.5mm, 0.65mm & 0.8mm Center – BGA Stamped Contact Specification (Scale 40:1) 0.5mm, 0.65mm & 0.8mm Center – LGA/QFN Stamped Contact Specification (Scale 40:1) 7|Page SBT.doc, Rev.
Tel: (800) 404-0204 www.ironwoodelectronics.com 1mm & 1.27mm Center – BGA Stamped Contact Specification (Scale 25:1) 1mm & 1.27mm Center – LGA/QFN Stamped Contact Specification( Scale 25:1) 8|Page SBT.doc, Rev.
Tel: (800) 404-0204 www.ironwoodelectronics.com Socket Maintenance Setting up a Preventative Maintenance Program is important in maintaining both Socket and Test Probe life expectancy as well as good electrical continuity which will help minimize false rejects and low test yields. Generally, light cleaning is recommended for a preventative maintenance program of the test socket assembly. The most effective way to determine a schedule is by tracking test yields.
Tel: (800) 404-0204 www.ironwoodelectronics.com Repeated mechanical cleaning of the probe tips will shorten the time period between required maintenance and more importantly it will start to remove surface plating which can result in continuity issues as well as contact failures and increased resistance. Heavy cleaning should be avoided if possible and if needed should only be performed once in the lifetime of the test probes.
