Specifications

AW3155-50
www.sziton.com V0.3 - Jul., 2021
1. Device Overview
1.1 Features
1.1.1 General Features
 32bit MCU for Wi-Fi protocols and host offload
 32bit MCU for Bluetooth controller
 Embedded SRAM/ROM
 Programmable and multiplexed GPIO pins
 Integrated high efficiency power management unit
 15.0mm*13.0mm LGA package
1.1.2 IEEE 802.11X Key Features
 IEEE 802.11 a/b/g/n/ac compliant
 Supports 20MHz, 40MHz, 80MHz bandwidth in 2.4GHz/5GHz band
 Integrated LNA, PA, T/R switch and diplexer
 Comprehensive RF and analog self-calibration
 SDIO 3.0 interface up to 208MHz
 STBC decoding
 LDPC encoding and decoding
 Beam-forming receiving
 AMPDU and AMSDU for maximum throughput
 GTK offload (optional)
 ARP/NS offload (optional)
 DHCP offload (optional)
 Wake-on-Wireless with programmable magic packet
 TCP/UDP Keep Alive
 P2P concurrent mode
1.1.3 Bluetooth Key Features
 Integrated Balun and PA
 Dual-mode BT 5.0 supporting BDR, EDR, LE1M, LE2M, LE2S and LE8S rates
 Supports LE privacy, DPLE, LE secure connection
 Supports HS UARTand PCM host interfaces
 Supports eSCO with retransmission
 Supports 2 antenna configuration
 Supports AFH for interference avoidance
 Supports Bluetooth Core 5.0 features
 Supports Bluetooth Core 4.2 features
 Supports low power mode
ITON Technology Corp. Page 3 of 18