Datasheet

ManualsBrandsIXYS ManualsPMICsPMIC - gate drivers Non-inverting Low side SOIC 8 EP

DS-IXD_609-R02 www.clare.com 1

RoHS

2002/95/EC

Features

• 9A Peak Source/Sink Drive Current

• Wide Operating Voltage Range: 4.5V to 35V

• -40°C to +125°C Extended Operating Temperature

Range

• Logic Input Withstands Negative Swing of up to 5V

• Matched Rise and Fall Times

• Low Propagation Delay Time

• Low, 10A Supply Current

• Low Output Impedance

Applications

• Efficient Power MOSFET and IGBT Switching

• Switch Mode Power Supplies

• Motor Controls

• DC to DC Converters

• Class-D Switching Amplifiers

• Pulse Transformer Driver

Description

The IXDD609/IXDI609/IXDN609 high-speed gate

drivers are especially well suited for driving the latest

IXYS MOSFETs and IGBTs. The IXD_609

high-current output can source and sink 9A of peak

current while producing voltage rise and fall times of

less than 25ns. The input is CMOS compatible, and is

virtually immune to latch up. Proprietary circuitry

eliminates cross-conduction and current

“shoot-through.” Low propagation delay and fast,

matched rise and fall times make the IXD_609 family

ideal for high-frequency and high-power applications.

The IXDD609 is configured as a non-inverting driver

with an enable, the IXDN609 is configured as a

non-inverting driver, and the IXDI609 is configured as

an inverting driver.

The IXD_609 family is available in a standard 8-pin

DIP (PI); an 8-pin SOIC (SIA); an 8-pin Power SOIC

with an exposed metal back (SI); an 8-pin DFN (D2); a

5-pin TO-263 (YI); and a 5-pin TO-220 (CI).

Ordering Information

Part Number

Logic

Configuration

Package Type

Packing

Method

Quantity

IXDD609D2TR 8-Pin DFN Tape & Reel 2000

IXDD609SI 8-Pin Power SOIC with Exposed Metal Back Tube 100

IXDD609SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000

IXDD609SIA 8-Pin SOIC Tube 100

IXDD609SIATR 8-Pin SOIC Tape & Reel 2000

IXDD609PI 8-Pin DIP Tube 50

IXDD609CI 5-Pin TO-220 Tube 50

IXDD609YI 5-Pin TO-263 Tube 50

IXDI609SI 8-Pin Power SOIC with Exposed Metal Back Tube 100

IXDI609SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000

IXDI609SIA 8-Pin SOIC Tube 100

IXDI609SIATR 8-Pin SOIC Tape & Reel 2000

IXDI609PI 8-Pin DIP Tube 50

IXDI609CI 5-Pin TO-220 Tube 50

IXDI609YI 5-Pin TO-263 Tube 50

IXDN609SI 8-Pin Power SOIC with Exposed Metal Back Tube 100

IXDN609SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000

IXDN609SIA 8-Pin SOIC Tube 100

IXDN609SIATR 8-Pin SOIC Tape & Reel 2000

IXDN609PI 8-Pin DIP Tube 50

IXDN609CI 5-Pin TO-220 Tube 50

IXDN609YI 5-Pin TO-263 Tube 50

OUT

IN OUT

IXD_609

9-Ampere Low-Side

Ultrafast MOSFET Drivers

Summary of content (14 pages)

PAGE 1
IXD_609 9-Ampere Low-Side Ultrafast MOSFET Drivers Features Description • 9A Peak Source/Sink Drive Current • Wide Operating Voltage Range: 4.5V to 35V • -40°C to +125°C Extended Operating Temperature Range • Logic Input Withstands Negative Swing of up to 5V • Matched Rise and Fall Times • Low Propagation Delay Time • Low, 10A Supply Current • Low Output Impedance The IXDD609/IXDI609/IXDN609 high-speed gate drivers are especially well suited for driving the latest IXYS MOSFETs and IGBTs.
PAGE 2
IXD_609 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PAGE 3
IXD_609 1 Specifications 1.1 Pin Configurations 1.
PAGE 4
IXD_609 1.5 Electrical Characteristics: TA = 25°C Test Conditions: 4.5V < VCC < 35V (unless otherwise noted). Conditions Symbol Minimum Typical Maximum Input Voltage, High Parameter 4.5V < VCC < 18V VIH 3.0 - - Input Voltage, Low 4.5V < VCC < 18V VIL - - 0.8 0V < VIN < VCC IIN ±10 A IXDD609 only VENH 2/3VCC - EN Input Voltage, High - EN Input Voltage, Low IXDD609 only VENL - V Output Voltage, High - VOH VCC-0.025 1/3VCC - - Output Voltage, Low - VOL - - 0.
PAGE 5
IXD_609 1.7 Thermal Characteristics Package Parameter Symbol Rating D2 (8-Pin DFN) 35 CI (5-Pin TO-220) 36 PI (8-Pin DIP) 125 JA Thermal Resistance, Junction-to-Ambient SI (8-Pin Power SOIC) 85 SIA (8-Pin SOIC) 120 YI (5-Pin TO-263) 46 CI (5-Pin TO-220) Units °C/W 3 JC Thermal Resistance, Junction-to-Case SI (8-Pin Power SOIC) 10 YI (5-Pin TO-263) °C/W 2 2 IXD_609 Performance 2.
PAGE 6
IXD_609 3 Block Diagrams & Truth Tables 3.1 IXDD609 3.3 IXDN609 VCC VCC IN OUT IN OUT GND EN GND IN EN OUT IN OUT 0 1 or open 0 0 0 1 1 or open 1 1 1 x 0 Z 3.2 IXDI609 VCC OUT IN GND 6 IN OUT 0 1 1 0 www.clare.
PAGE 7
IXD_609 4 Typical Performance Characteristics Rise Time vs. Supply Voltage (Input=0-5V, f=10kHz, TA=25ºC) 60 40 30 20 CL=10nF CL=5.4nF CL=1.5nF 40 30 20 10 10 0 5 10 15 20 25 Supply Voltage (V) 30 35 0 5 10 15 20 25 Supply Voltage (V) VCC=4.
PAGE 8
IXD_609 300 200 100 0 1000 150 100 50 150 100 50 0 1000 10000 10000 Load Capacitance (pF) Supply Current vs. Frequency (VCC=18V) Supply Current vs. Frequency (VCC=12V) Supply Current vs. Frequency (VCC=8V) 1000 1 1000 CL=10nF CL=5.4nF CL=1.5nF 100 10 1 10 100 1000 Frequency (kHz) 10000 1 10 100 1000 Frequency (kHz) 1.0 0.8 0.6 0.4 0.2 VIN=0V & 18V 0 1 0.1 20 40 60 80 Temperature (ºC) 10000 1 10 100 1000 Frequency (kHz) 10000 0.60 0.55 0.50 0.45 0.40 0.
PAGE 9
IXD_609 Output Source Current vs. Temperature (VCC=18V, f=422Hz, CL=66nF) 14.0 Output Sink Current (A) Output Source Current (A) -12.0 -11.5 -11.0 -10.5 -10.0 -9.5 -9.0 -40 -20 13.0 12.5 12.0 11.5 11.0 10.5 100 120 140 -40 -20 1.0 0.5 0 20 40 60 80 Temperature (ºC) 100 120 140 Low State Output Resistance vs. Supply Voltage (IOUT= +10mA ) 1.1 Output Resistance (Ω) Output Resistance (Ω) 20 40 60 80 Temperature (ºC) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.0 0 R02 13.5 10.
PAGE 10
IXD_609 5 Manufacturing Information 5.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation.
PAGE 11
IXD_609 5.4 Mechanical Dimensions 5.4.1 SIA (8-Pin SOIC) 0.10 / 0.25 (0.004 / 0.010) 1.27 (0.050) 0.40 / 1.27 (0.016 / 0.050) 3.80 / 4.00 (0.150 / 0.157) 5.80 / 6.20 (0.228 / 0.244) 5.40 (0.213) 1.55 (0.061) PIN 1 0.31 / 0.51 (0.012 / 0.020) 1.27 BSC (0.05 BSC) 0.25 / 0.50 x45º (0.010 / 0.020 x45º) 0.60 (0.024) 0º / 8º 4.80 / 5.00 (0.190 / 0.197) Recommended PCB Land Pattern Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 0.10 / 0.25 (0.004 / 0.010) 1.30 / 1.75 (0.051 / 0.
PAGE 12
IXD_609 5.4.3 Tape & Reel Information for SI and SIA Packages 330.2 DIA. (13.00 DIA.) 0.30 ± 0.05 B R0.50 TYP ∅1.55 ± 0.05 4.00 ± 0.10 See Note #2 2.00 ± 0.10 1.75 ± 0.10 Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 5.50 ± 0.10 (3.40) B0=5.20 ± 0.10 A Embossed Carrier 1.80 ± 0.10 K0=2.30 ± 0.10 SECTION B-B B A0=6.40 ± 0.10 Embossment 12.00 ± 0.30 A 8.00 ± 0.10 ∅1.50 (MIN) (4.70) (1.20) (70º) NOTES: 1. A0 & B0 measured at 0.3mm above base of pocket. 2. 10 pitches cumulative tol. ± 0.
PAGE 13
IXD_609 5.4.5 PI (8-Pin DIP) 9.02 / 10.16 (0.355 / 0.400) 0.20 / 0.38 (0.008 / 0.015) 6.10 / 6.86 (0.240 / 0.270) 7.37 / 8.26 (0.290 / 0.325) 3.05 / 3.81 (0.120 / 0.150) 2.540 (0.100) 7.50 (0.295) 1.40 (0.055) 7.62 BSC (0.300 BSC) 2.540 BSC (0.100 BSC) 0.38 / 1.02 (0.015 / 0.040) 8-0.900 DIA. (8-0.035 DIA.) 7.62 / 10.92 (0.300 / 0.430) PC Board Pattern 3.43 / 4.70 (0.135 / 0.185) Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 1.14 / 1.65 (0.045 / 0.065) 0.38 / 0.58 (0.015 / 0.023) 3.
PAGE 14
IXD_609 5.4.7 D2 (8-Pin DFN) 5.00 BSC (0.197 BSC) 0.80 / 1.00 (0.031 / 0.039) 0.20 REF (0.008 REF) Pin 1 4.00 BSC (0.158 BSC) 0.35 x 45º (0.014 x 45º) 0.95 (0.037) 4.50 (0.177) 3.05 (0.120) 0.45 (0.018) 0.00 / 0.05 (0.000 / 0.002) 2.55 (0.100) 1.20 (0.047) 0.76 / 0.81 (0.030 / 0.032) Recommended PCB Land Pattern 3.04 / 3.09 (0.120 / 0.122) Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 0.30 / 0.45 (0.012 / 0.018) 0.95 BSC (0.037 BSC) Pin 1 Pin 8 2.54 / 2.59 (0.100 / 0.102) 0.35 / 0.