Datasheet

IXD_609
10 www.clare.com R02
5 Manufacturing Information
5.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified
all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint
industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our
products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
5.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
5.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
Device Moisture Sensitivity Level (MSL) Rating
IXD_609SI / IXD_609SIA / IXD_609PI /IXD_609CI / IXD_609YI MSL 1
IXD_609D2 MSL 3
Device Maximum Temperature x Time
IXD_609CI / IXD_609YI 245°C for 30 seconds
IXD_609PI 250°C for 30 seconds
IXD_609SI / IXD_609SIA / IXD_609D2 260°C for 30 seconds
RoHS
2002/95/EC
e
3
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