Datasheet

IXD_609
R02 www.clare.com 5
1.7 Thermal Characteristics
2 IXD_609 Performance
2.1 Timing Diagrams
2.2 Characteristics Test Diagram
Package Parameter Symbol Rating Units
D2 (8-Pin DFN)
Thermal Resistance, Junction-to-Ambient

JA
35
°C/W
CI (5-Pin TO-220)
36
PI (8-Pin DIP)
125
SI (8-Pin Power SOIC)
85
SIA (8-Pin SOIC)
120
YI (5-Pin TO-263)
46
CI (5-Pin TO-220)
Thermal Resistance, Junction-to-Case

JC
3
°C/W
SI (8-Pin Power SOIC)
10
YI (5-Pin TO-263)
2
10%
90%
t
ondly
t
offdly
t
r
t
f
V
IH
V
IL
IN
OUT
10%
90%
t
ondly
t
offdly
t
f
t
r
V
IH
V
IL
IN
OUT
EN
IN OUT
GND
V
CC
V
CC
+
-
V
IN
0.1μF10μF
Tektronix
Current Probe
6302
C
LOAD
V
CC