Datasheet

© 2000 IXYS All rights reserved
1 - 4
Symbol Conditions Maximum Ratings
V
CES
T
J
= 25°C to 150°C 1200 V
V
CGR
T
J
= 25°C to 150°C; R
GE
= 20 kW 1200 V
V
GES
Continuous ±20 V
V
GEM
Transient ±30 V
I
C25
T
C
= 25°C 60 A
I
C90
T
C
= 90°C 38 A
I
CM
T
C
= 90°C, t
p
= 1 ms 76 A
RBSOA V
GE
= ±15 V, T
J
= 125°C, R
G
= 47 W I
CM
= 50 A
Clamped inductive load, L = 30 µH V
CEK
< V
CES
t
SC
V
GE
= ±15 V, V
CE
= V
CES
, T
J
= 125°C 10 µs
(SCSOA) R
G
= 47 W, non repetitive
P
C
T
C
= 25°C IGBT 300 W
Diode 135 W
T
J
-55 ... +150 °C
T
stg
-55 ... +150 °C
Maximum lead temperature for soldering 300 °C
1.6 mm (0.062 in.) from case for 10 s
M
d
Mounting torque 1.1/10 Nm/lb.in.
Weight 6g
V
CES
= 1200 V
I
C25
= 60 A
V
CE(sat) typ
= 2.4 V
Features
NPT IGBT technology
low saturation voltage
low switching losses
square RBSOA, no latch up
high short circuit capability
positive temperature coefficient for
easy paralleling
MOS input, voltage controlled
optional ultra fast diode
International standard packages
Advantages
Space savings
High power density
IXDT:
surface mountable high power package
Typical Applications
AC motor speed control
DC servo and robot drives
DC choppers
Uninteruptible power supplies (UPS)
Switch-mode and resonant-mode
power supplies
High Voltage IGBT
with optional Diode
Short Circuit SOA Capability
Square RBSOA
IXDH 30N120
IXDH 30N120 D1
IXDT 30N120
IXDT 30N120 D1
Symbol Conditions Characteristic Values
(T
J
= 25°C, unless otherwise specified)
min. typ. max.
V
(BR)CES
V
GE
= 0 V 1200 V
V
GE(th)
I
C
= 1 mA, V
CE
= V
GE
4.5 6.5 V
I
CES
V
CE
= V
CES
T
J
= 25°C 1.5 mA
T
J
= 125°C 2.5 mA
I
GES
V
CE
= 0 V, V
GE
= ± 20 V ± 500 nA
V
CE(sat)
I
C
= 30 A, V
GE
= 15 V 2.4 2.9 V
TO-247 AD (IXDH)
G
E
C
C (TAB)
TO--268 AA (IXDT)
G
E
C (TAB)
G = Gate, E = Emitter
C = Collector , TAB = Collector
IXDH 30N120 IXDH 30N120 D1
IXDT 30N120 IXDT 30N120 D1
G
C
E
G
C
E
031

Summary of content (4 pages)