Datasheet

© 2006 IXYS All rights reserved
Symbol Test Conditions Maximum Ratings
V
DSS
T
J
= 25° C to 150° C 500 V
V
DGR
T
J
= 25° C to 150° C; R
GS
= 1 MΩ 500 V
V
GS
Continuous ±30 V
V
GSM
Transient ±40 V
I
D25
T
C
= 25° C16A
I
DM
T
C
= 25° C, pulse width limited by T
JM
35 A
I
AR
T
C
= 25° C16A
E
AR
T
C
= 25° C25mJ
E
AS
T
C
= 25° C 750 mJ
dv/dt I
S
≤ I
DM
, di/dt ≤ 100 A/µs, V
DD
≤ V
DSS
, 10 V/ns
T
J
≤ 150° C, R
G
= 10 Ω
P
D
T
C
= 25° C 300 W
T
J
-55 ... +150 °C
T
JM
150 °C
T
stg
-55 ... +150 °C
T
L
1.6 mm (0.062 in.) from case for 10 s 300 °C
T
SOLD
Plastic body for 10 s soldering 260 °C
M
d
Mounting torque (TO-247 & TO-220) 1.13/10 Nm/lb.in.
Weight TO-220 4 g
TO-263 3 g
TO-247 5.5 g
G = Gate D = Drain
S = Source TAB = Drain
DS99357E(03/06)
Symbol Test Conditions Characteristic Values
(T
J
= 25° C, unless otherwise specified) Min. Typ. Max.
BV
DSS
V
GS
= 0 V, I
D
= 250 µA 500 V
V
GS(th)
V
DS
= V
GS
, I
D
= 2.5 mA 3.0 5.5 V
I
GSS
V
GS
= ±30 V
DC
, V
DS
= 0 ±100 nA
I
DSS
V
DS
= V
DSS
5 µA
V
GS
= 0 V T
J
= 125° C 250 µA
R
DS(on)
V
GS
= 10 V, I
D
= 0.5 I
D25
400 mΩ
Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
PolarHV
TM
HiPerFET
Power MOSFET
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Diode
Features
l
International standard packages
l
Unclamped Inductive Switching (UIS)
rated
l
Low package inductance
- easy to drive and to protect
Advantages
l
Easy to mount
l
Space savings
l
High power density
TO-263 (IXTA)
G
S
(TAB)
IXFA 16N50P
IXFH 16N50P
IXFP 16N50P
V
DSS
= 500 V
I
D25
= 16 A
R
DS(on)
≤≤
≤≤
≤ 400 m
ΩΩ
ΩΩ
Ω
t
rr
≤≤
≤≤
≤
200 ns
TO-247 (IXFH)
G
D
S
TO-220 (IXTP)
D
(TAB)
G
S
D (TAB)