Datasheet

LAA110
www.clare.com
5
R09
Dimensions
mm
(inches)
7.239 TYP.
(0.285)
3.302
(0.130)
9.144 TYP.
(0.360)
8-Pin DIP Through Hole (Standard)
7.620 ± 0.254
(0.300 ± 0.010)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
8.077 ± 0.127
(0.318 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
PC Board Pattern
(Top View)
8-0.800 DIA.
(8-0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
3.302
(0.130)
0.254 TYP.
(0.010)
0.635 TYP.
(0.025)
8-Pin Surface Mount (“S” Suffix)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
8.077 ± 0.127
(0.318 ± 0.005)
PC Board Pattern
(Top View)
2.540 ± 0.127
(0.100 ± 0.005)
8.305 ± 0.127
(0.327 ± 0.005)
1.905 ± 0.127
(0.075 ± 0.005)
1.498 ± 0.127
(0.059 ± 0.005)
PC Board Pattern
(Top View)
1.193
(0.047)
0.787
(0.031)
2.540 ± 0.127
(0.100 ± 0.005)
8.763 ± 0.127
(0.345 ± 0.005)
8-Pin Flatpack (“P” Suffix)
2.159 TYP.
(0.085)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025)
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
9.398 ± 0.127
(0.370 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
8.077 ± 0.127
(0.318 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
2.286 MAX.
(0.090)
0.203
(0.008)
MECHANICAL DIMENSIONS
Manufacturing Information
Soldering
For proper assembly, the component must be
processed in accordance with the current revision
of IPC/JEDEC standard J-STD-020. Failure to
follow the recommended guidelines may cause
permanent damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
Recommended soldering processes are limited to
260ºC component body temperature for 10 seconds.
Washing
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
e
3
RoHS
2002/95/EC