User's Manual

SMT Reflow Profile
A DIVISION OF TRIMBLE
46 Hardware Overview
SMT Reflow Profile
Short profiles are recommended for reflow soldering processes. Peak zone temperature
should be adjusted high enough to ensure proper wetting and optimized forming of solder
joints.
Generally speaking, unnecessary long exposure and exposure to more than 245C should
be avoided.
To not overstress the assembly, the complete reflow profile should be as short as
possible. Here an optimization considering all components on the application must be
performed. The optimization of a reflow profile is a gradual process. It needs to be
performed for every paste, equipment and product combination. The presented profiles
are only samples and valid for the used pastes, reflow machines and test application
boards. Therefore a "ready to use" reflow profile can not be given.
There must be only be one reflow cycle, maximum.