User's Manual

Host Board Design
A DIVISION OF TRIMBLE
50 Hardware Integration
Peripheral pads as shown on the footprint are what the ThingMagic Nano module will
mount to. These peripheral pads are at a pitch of 1.25 mm. The intention for the
ThingMagic Nano module is to use routed-through via connections with 0.7 mm diameter
edge vias. The pads of the ThingMagic Nano module underside should align with the
copper pads of the footprint, with a pad exposure extending outside the M6e-Nano edge
be a nominal 0.5 mm. A 0.5 mm keep-out shall surround any non-ground pad. The
40 3.75 -0.5
41 2.5 -0.5