User's Guide
Table Of Contents
- COPYRIGHT INFORMATION
- TECHNICAL SUPPORT AND CONTACT INFORMATION
- Introduction
- Hardware Overview
- SMT Reflow Profile
- Host Board Design
- ThingMagic M3e Carrier Board
- TBD
- Programming for ThingMagic M3e
- Upgrading the ThingMagic M3e
- Verifying Application Firmware Image
- Host-to-Reader Communication
- Reader-to-Host Communication
- CCITT CRC-16 Calculation
- Power Modes
- Federal Communication Commission (FCC) Interference Statement
- User Manual Requirement
- End Product Labeling
- End Product Labeling
- Authorized Antennas
- Antennas
- Antennas
- Both the HF antenna and the LF antenna are attached to the Carrier Board.
- The HF antenna is embedded in the PCB of the Carrier Board.
- The LF antenna is connected to the Carrier Board.
- Powering Up and Connecting to a PC
- USB/RS232
- ESD Damage Overview
- Identifying ESD as the Cause of Damaged Readers
- Common Installation Best Practices
- Environmental
ThingMagic M3e User Guide
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Tape Dimensions
SMT Reflow Profile
Short reflow profiles are recommended for soldering processes. Peak zone temperature should be
adjusted high enough to ensure proper wetting and optimized forming of solder joints.
Unnecessary long exposure and exposure to more than 245°C should be avoided.
To not overstress the assembly, the complete reflow profile should be as short as possible. An optimization
considering all components on the application must be performed. The optimization of a reflow profile is a
gradual process. It needs to be performed for every paste, equipment, and product combination. The
presented profiles are only samples and valid for the used pastes, reflow machines and test application
boards. Therefore a "ready to use" reflow profile cannot be given.
SMT Reflow Profile
There must be only be one reflow cycle, maximum.