User's Guide
Table Of Contents
- COPYRIGHT INFORMATION
- TECHNICAL SUPPORT AND CONTACT INFORMATION
- Introduction
- Hardware Overview
- SMT Reflow Profile
- Host Board Design
- ThingMagic M3e Carrier Board
- TBD
- Programming for ThingMagic M3e
- Upgrading the ThingMagic M3e
- Verifying Application Firmware Image
- Host-to-Reader Communication
- Reader-to-Host Communication
- CCITT CRC-16 Calculation
- Power Modes
- Federal Communication Commission (FCC) Interference Statement
- User Manual Requirement
- End Product Labeling
- End Product Labeling
- Authorized Antennas
- Antennas
- Antennas
- Both the HF antenna and the LF antenna are attached to the Carrier Board.
- The HF antenna is embedded in the PCB of the Carrier Board.
- The LF antenna is connected to the Carrier Board.
- Powering Up and Connecting to a PC
- USB/RS232
- ESD Damage Overview
- Identifying ESD as the Cause of Damaged Readers
- Common Installation Best Practices
- Environmental
ThingMagic M3e User Guide
24
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Hardware Integration
ThingMagic M3e can integrate with other systems to create RFID-enabled products. This chapter
discusses requirements for a host board design and characteristics of the M3e Carrier Board offered in the
Development Kit and for applications where standard connectors are required to interface the module with
a host board.
Host Board Design
Landing Pads
The following diagram shows the position and recommended size of the landing pads.
TBD – Revant has this in Altium – will export a version to put here.
Put a pic here with just a few measurements – enough for someone to recreate.
Put a link here to our website
Put in a table of X-Y coordinates
ThingMagic M3e module mounts to the host board via the landing pads. These pads are at a pitch of 1.25
mm. The intention is for the ThingMagic M3e module to use routed-through via connections with 0.7 mm
diameter edge vias. The pads of the ThingMagic M3e module underside should align with the copper pads
of the footprint, with a pad exposure extending outside the M3e edge be a nominal 0.5 mm. A 0.5 mm
keep-out shall surround any non-ground pad. The module pad positional tolerance shall be not more than
+/-0.2 mm to support contact alignment during fixturing.
The circuitry feeding the RF pad of the M3e shall be optimized for connecting to a coplanar wave guide
with ground plane beneath. For pad and trace dimensions, refer to the document Advice for Carrier Board
Layout, downloadable from the website.
The area beneath the module should be kept clear of traces and copper.
ThingMagic M3e Carrier Board
TBD