Data Sheet

Hardware design SPBT2632C2A
16/27 Doc ID 022833 Rev 4
7 Hardware design
The SPBT2632C2A module without AT2 command embedded FW supports UART, SPI, I
2
C
and GPIO hardware interfaces. Note that the usage of these interfaces is dependent upon
the firmware that is loaded into the module, and is beyond the scope of this document. The
AT2 command interface uses the main UART by default.
Note: 1 All unused pins should be left floating; do not ground.
2 All GND pins must be well grounded.
3 The area around the module should be free of any ground planes, power planes, trace
routings, or metal for 6 mm from the antenna in all directions.
4 Traces should not be routed underneath the module.
7.1 Module reflow installation
The SPB2632C2A is a surface mount Bluetooth module supplied on a 16-pin, 6-layer PCB.
The final assembly recommended reflow profiles are indicated here below.
The soldering phase must be executed with care: In order to avoid undesired melting
phenomenon, particular attention must be paid to the setup of the peak temperature.
The following are some suggestions for the temperature profile based on IPC/JEDEC J-
STD-020C, July 2004 recommendations.
Table 8. Soldering
Profile feature PB-free assembly
Average ramp-up rate (T
SMAX
to T
P
) 3 °C/sec max
Preheat:
– Temperature min. (T
S
min.)
– Temperature max. (T
S
max.)
–Time (t
s
min. to t
s
max.)(t
s
)
150 °C
200 °C
60-100 sec
Time maintained above:
– Temperature T
L
– Temperature T
L
217 °C
60-70 sec
Peak temperature (T
P
) 240 + 0 °C
Time within 5 °C of actual peak temperature (T
P
) 10-20 sec
Ramp-down rate 6 °C/sec
Time from 25 °C to peak temperature 8 minutes max.