Data Sheet

DOC No: WG3221-00-DTS-R01

____________________________________________________________________________________

http://WWW.JORJIN.COM.TW

Index

1. OVERVIEW .......................................................................................................... 3

1.1. GENERAL FEATURES ............................................................................................... 3

2. FUNCTIONAL FEATURES ...................................................................................... 4

2.1. MODULE BLOCK DIAGRAM ...................................................................................... 4

3. MODULE OUTLINE .............................................................................................. 5

3.1. SIGNAL LAYOUT (TOP VIEW) .................................................................................... 5

3.2. PIN DESCRIPTION .................................................................................................. 6

4. MODULE SPECIFICATIONS ................................................................................... 9

4.1. ABSOLUTE MAXIMUM RATINGS

(1)(2)

.......................................................................... 9

4.2. RECOMMENDED OPERATING CONDITIONS ................................................................... 9

4.3. POWER SEQUENCING: .......................................................................................... 10

4.4. DIGITAL LOGIC CHARACTERISTICS ............................................................................ 13

4.5. EXTERNAL 32.768KHZ CLOCK ............................................................................... 14

4.6. WLAN RF CHARACTERISTICS ................................................................................ 15

4.7. BT RF CHARACTERISTICS ...................................................................................... 18

4.8. TYPICAL POWER CONSUMPTION ............................................................................. 19

5. DESIGN RECOMMENDATIONS ........................................................................... 21

5.1. REFERENCE SCHEMATIC ........................................................................................ 21

5.2. LAYOUT RECOMMENDATION .................................................................................. 22

6. PACKAGE INFORMATION ................................................................................... 23

6.1. MODULE MECHANICAL OUTLINE ............................................................................ 23

6.2. RECOMMENDED LAND PATTERN ............................................................................. 24

6.3. RF CONNECTOR .................................................................................................. 25

6.4. ORDERING INFORMATION ...................................................................................... 25

6.5. PACKAGE MARKING ............................................................................................. 26

6.6. TAPE REEL INFORMATION ....................................................................................... 27

7. SMT AND BAKING RECOMMENDATION ............................................................. 28

7.1. BAKING RECOMMENDATION .................................................................................. 28