Data Sheet

Doc No: WG7833-B0-DTS-R06
Copyright © JORJIN TECHNOLOGIES INC. 2018
http://www.jorjin.com.tw
CONFIDENTIAL
Page 12
4. MODULE SPECIFICATION
4.1. General Module Requirements and Operation
4.1.1. Absolute Maximum Ratings
(1)
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under
“operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect
device reliability.
(2) 4.8 V cumulative to 2.33 years, including charging dips and peaks
(3) Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by electrostatic discharges into
device.
(4) Level listed is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500V HBM allows safe
manufacturing with a standard ESD control process, and manufacturing with less than 500V HBM is possible if necessary
precautions are taken. Pins listed as 1000V may actually have higher performance.
(5) Level listed is the passing level per EIA-JEDEC JESD22-C101E. JEDEC document JEP157 states that 250V CDM allows safe
manufacturing with a standard ESD control process, and manufacturing with less than 250V CDM is possible if necessary
precautions are taken. Pins listed as 250V may actually have higher performance.
Parameter
Value
Units
VBAT
4.8
(2)
V
VIO
-0.5 to 2.1
V
Input voltage to Analog pins
-0.5 to 2.1
V
Input voltage limits (CLK_IN)
-0.5 to VIO
V
Input voltage to all other pins
-0.5 to (VIO + 0.5V)
V
Operating ambient temperature range
-40 to +85
(3)
°C
Storage temperature range
-55 to +125
°C
ESD Stress Voltage
(4)
Human Body Model
(5)
>1000
V
Charged Device Model
(6)
>250
V