Data Sheet

Doc No: WG7833-B0-DTS-R06
Copyright © JORJIN TECHNOLOGIES INC. 2018
http://www.jorjin.com.tw
CONFIDENTIAL
Page 3
1. OVERVIEW
WG7833-B0, a WiFi, BT, BLE SiP (system in package) module, is the most demanded design
for mobile devices, Audio, Computer, PDA and embedded system applications with Wilink8
solution from TI.
1.1. Models Functional Blocks
Model
WLAN 2.4GHz
WLAN 5GHz
BT/BLE
WG7833-B0
V
V
V
1.2. General Features
 WLAN, Bluetooth, BLE with Integrated RF Front-End Module (FEM), Power Amplifier (PA),
and Power Management on a Single Module.
 LGA106 pin package.
 Dimension 12.8mm(L) x 12.0mm(W) x 1.63mm(H)
 Provides efficient direct connection to battery by employing several integrated switched
mode power supplies (DC2DC).
 Seamless Integration with TI Sitara™ and Other Application Processors
 WLAN and BT/BLE cores are software and hardware compatible with prior WL127x and
WL128x offerings, for smooth migration to device.
 Shared HCI transport for BT/BLE over UART and SDIO for WLAN.
 Temperature detection and compensation mechanism ensures minimal variation in RF
performance over the entire temperature range.
 BT, BLE and all audio processing features work in parallel and include full coexistence with
WLAN
 Operating temperature: –40°C to 85°C