JORJIN WiFi and Bluetooth Module : Data Sheet : Page 38

Part number:WG7837-V1

Model name :WG7837-V0

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http://www.jorjin.com.tw

CONFIDENTIAL

 Have a complete ground pour in layer 2 for thermal dissipation. (See Figure 9-2)

 Have a solid ground plane and ground vias under the module for stable system and

thermal dissipation. (See Figure 9-2)

 Increase the ground pour in the first layer and have all of the traces from the first layer on

the inner layers, if possible.

 Signal traces can be run on a third layer under the solid ground layer, which is below the

module mounting layer.

 The module uses μvias for layers 1 through 6 with full copper filling, providing heat flow all

the way to the module ground pads. We recommends using one big ground pad under the

module with vias all the way to connect the pad to all ground layers (see Figure 9-3).

Figure 9-1 Module Layout : Layer-1