Data Sheet

Part number:WG7837-V1
Model name :WG7837-V0
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CONFIDENTIAL
2. OVERVIEW
The WG7837-V1 series SiP (System in Package) module, is the most demanded design for
all handset and portable devices with TI WiLink8 IEEE 802.11 a/b/g/n and Bluetooth,
Bluetooth LE solutions to provide the best WiFi and BT coexistence interoperability and power
saving technologies from TI.
Models Functional Blocks
Module
P/N
WLAN
2.4GHz SISO
WLAN 2.4GHz
MIMO
(1)
WLAN 2.4GHz
MRC
(2)
WLAN 5GHz
SISO
(1)
Bluetooth /
Bluetooth LE
WG7837-
V1
V V V V V
(1) SISO: single input, single output; MIMO: multiple input, multiple output.
(2) MRC: maximum ratio combining.
General Features
 Integrates RF, Power Amplifiers (PAs), Clock, RF Switches, Filters, Passives and Power
Management.
 LGA-100 pin package
 Small Form Factor: 13.3 x 13.4 x 2.0 mm.
 FCC, IC, ETSI/CE, and TELEC Certified With Chip Antennas
 Operating temperature: -40°C to 85°C
Applications
 Internet of Things (IoT)
 Multimedia
 Home Electronics
 Home Appliances and White Goods
 Industrial and Home Automation
 Smart Gateway and Metering
 Video Conferencing
 Video Camera and Security