Data Sheet
Table Of Contents
- Document Information
- Contents
- 1 Functional description
- 2 Interfaces
- 3 Pin definition
- 4 Electrical specifications
- 4.1 Absolute maximum rating
- 4.2 Operating conditions
- 4.2.1 Operating temperature range
- 4.2.2 Thermal parameters
- 4.2.3 Supply/power pins
- 4.2.4 Current consumption
- 4.2.5 LTE RF characteristics
- 4.2.6 2G RF characteristics
- 4.2.7 ANT_DET pin characteristics
- 4.2.8 PWR_ON pin
- 4.2.9 RESET_N pin
- 4.2.10 SIM pins
- 4.2.11 USB pins
- 4.2.12 Generic Digital Interfaces pins
- 4.2.13 DDC (I2C) pins
- 4.3 Parameters for ATEX applications
- 5 Mechanical specifications
- 6 Qualification and approvals
- 7 Product handling & soldering
- 8 Labeling and ordering information
- Appendix
- A Glossary
- Related documents
- Revision history
- Contact
SARA-R4/N4 series - Data Sheet
UBX-16024152 - R16 Electrical specifications Page 20 of 39
4.2 Operating conditions
☞ Unless otherwise indicated, all operating condition specifications are at an ambient temperature
of +25 °C.
⚠ Operation beyond the operating conditions is not recommended and extended exposure beyond
them may affect device reliability.
4.2.1 Operating temperature range
Parameter
Min.
Typ.
Max.
Unit
Remarks
Normal operating
temperature
–20
+25
+65
°C
Normal operating temperature range
(fully functional and meet 3GPP / ETSI specifications)
Extended operating
temperature
–40
+85
°C
Extended operating temperature range
(RF performance may be affected outside normal operating range,
though module is fully functional)
Table 8: Environmental conditions
4.2.2 Thermal parameters
Symbol
Parameter
Min.
Typ.
Max.
Unit
Remarks
Ψ
M-A
Module-to-Ambient
thermal parameter
10
°C/W
Thermal characterization parameter
Ψ
M-A
= (T
M
– T
A
) / P
H
proportional to the temperature difference
between the internal temperature sensor of the module (T
M
) and
the ambient temperature (T
A
), produced by the module heat power
dissipation (P
H
), with the module mounted on a 79 x 62 x 1.41 mm 4-
Layer PCB with a high coverage of copper, in still air conditions
Ψ
M-C
Module-to-Case
thermal parameter
2
°C/W
Thermal characterization parameter
Ψ
M-C
= –T
M
- T
C
) / P
H
proportional to the temperature difference
between the internal temperature sensor of the module (T
M
) and
the ambient temperature (T
C
), produced by the module heat power
dissipation (P
H
), with the module mounted on a 79 x 62 x 1.41 mm 4-
Layer PCB with a high coverage of copper, with a robust aluminum
heat-sink and with forced air ventilation, i.e. reducing to a value
close to 0 °C/W the thermal resistance from the case of the module
to the ambient
Table 9: Thermal characterization parameters of the module