Datasheet

12© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2020_A700 • 11/25/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
12
Aluminum Organic Capacitor (AO-CAP)
A700 Polymer Aluminum, 2 – 25 VDC
Soldering Process
KEMET’sfamiliesofsurfacemountcapacitorsare
compatible with wave (single or dual), convection, IR,
orvaporphasereowtechniques.Preheatingofthese
componentsisrecommendedtoavoidextremethermal
stress.KEMET'srecommendedproleconditionsfor
convectionandIRreowreecttheproleconditionsofthe
IPC/J–STD–020D standard for moisture sensitivity testing.
Thedevicescansafelywithstandamaximumofthreereow
passes at these conditions.
Please note that although the X/7343–43 case size can
withstandwavesoldering,thetallprole(4.3mmmaximum)
dictates care in wave process development.
Hand soldering should be performed with care due to the
dicultyinprocesscontrol.Ifperformed,careshouldbe
taken to avoid contact of the soldering iron to the molded
case. The iron should be used to heat the solder pad,
applying solder between the pad and the termination, until
reowoccurs.Oncereowoccurs,theironshouldbe
removed immediately. “Wiping” the edges of a chip and
heating the top surface is not recommended.
Prole Feature SnPb Assembly
Pb-Free Assembly
Preheat/Soak
Temperature Minimum
(T
Smin
)
100°C 150°C
TemperatureMaximum
(T
Smax
)
150°C 200°C
Time (t
s
) from T
smin
to T
smax
) 60 – 120 seconds 60 – 120 seconds
Ramp-up Rate (T
L
to T
P
) 3°C/secondsmaximum 3°C/secondsmaximum
Liquidous Temperature (T
L
) 183°C 217°C
Time Above Liquidous (t
L
) 60 – 150 seconds 60 – 150 seconds
Peak Temperature (T
P
)
220°C*
235°C**
250°C*
260°C**
Timewithin5°C
ofMaximumPeak
Temperature (t
P
)
20secondsmaximum 30secondsmaximum
Ramp-down Rate (T
P
to T
L
) 6°C/secondsmaximum 6°C/secondsmaximum
Time25°CtoPeak
Temperature
6minutesmaximum 8minutesmaximum
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reow.
* For Case Size height > 2.5 mm
** For Case Size height ≤ 2.5 mm
Time
Temperature
T
smin
25
T
smax
T
L
T
P
Maximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
t
P
t
L
t
s
25°C to Peak
Storage
AllAO-CAPSeriesareshippedinmoisturebarrierbags(MBBs)withdesiccantandhumidityindicatorcard(HIC).These
partsareclassiedasMSL3(MoistureSensitivityLevel3)perIPC/JEDECJ–STD–020andpackagedper
IPC/JEDECJ–STD–033.MSL3speciesaoortimeof168Hat30°Cmaximumtemperatureand60%relativehumidity.
Unused capacitors should be sealed in a MBB with fresh desiccant.
Thecalculatedshelflifeinasealedbagwouldbe12monthsfromabagsealdateinastorageenvironmentof<40°Cand
humidity<90%RH.Itshouldbe24monthsfromabagsealdateinastorageenvironmentof<30°Candhumidity<70%RH.
If baking is required, refer to IPC/JEDEC J–STD–033 for bake procedure.