Datasheet

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1073_HT_C0G_RADIAL_MOLDED • 8/10/2016 12
Radial Through-Hole Multilayer Ceramic Capacitors
High Temperature 200°C, Radial, Molded, C0G Dielectric, 50 – 200 VDC (Industrial Grade)
Table 3 – Ceramic Radial Tape and Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
D
0
±0.2 (0.008)
P
0
±0.3 (0.012)
P
±0.3 (0.012)
P
2
±0.7 (0.028)
∆H
Maximum
L
1
Maximum
t
Maximum
T
Maximum
W
+ 1.0/−0.5
(+0.039/−0.020)
W
0
Minimum
W
2
Maximum
4.00 (0.157) 12.7 (0.500) 12.7 (0.500) 6. 35 (0. 25 0) 1.0 (0.039) 1.0 (0.039) 0.9 (0.035) 2.0 (0.079) 18.0 (0.709) 5.0 (0.197) 3.0 (0.118)
Variable Dimensions — Millimeters (Inches)
F
+0.6 (0.024)
−0.2 (0.008)
Note 1
P
1
±0.7 (0.028)
Note 1
H
Minimum
Note 2
H
0
±0.5 (0.630)
Note 3
2.54 (0.100) 5.08 (0.200)
18.0 (0.709) 16.0 (0.024)
4.32 (0.170) 3.89 (0.153)
5.08 (0.200) 3.81 (0.150)
5.59 (0.220) 3.25 (0.128)
6.98 (0.275) 2.54 (0.100)
7.62 (0.300) 2.24 (0.088)
9.52 (0.375) 7.62 (0.300)
10.16 (0.400) 7.34 (0.290)
12.06 (0.475) 6.35 (0.250)
14.60 (0.575) 5.08 (0.200)
17.14 (0.675) 3.81 (0.15)
1. Measured at the egress from the carrier tape, on the component side.
2. Straight Lead con guration part types only.
3. Formed (bent) lead con guration part types only.
Symbol Reference Table
D
0
Sprocket Hole Diameter
P
0
Sprocket Hole Pitch
P Component Pitch
F
Lead Spacing
P
1
Sprocket Hole Center to Adjacent Component
Lead
P
2
Sprocket Hole Center to Component Center
H
Height to Seating Plane (Straight Leads Only)
H
0
Height to Seating Plane (Formed Leads Only)
H
1
Component Height Above Tape Center
∆H
Component Alignment
L
1
Lead Protrusion
t
Composite Tape Thickness
W
Carrier Tape Width
W
0
Hold-Down Tape Width
W
2
Hold-Down Tape Location