Datasheet

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1073_HT_C0G_RADIAL_MOLDED • 8/10/2016 2
Radial Through-Hole Multilayer Ceramic Capacitors
High Temperature 200°C, Radial, Molded, C0G Dielectric, 50 – 200 VDC (Industrial Grade)
Dimensions – Inches (Millimeters)
L T
H
LL
S
0.045
(1.143)
Maximum
LD
L T
H
LL
S
LD
C052H C062H
Series
S
Lead Spacing
L
Length
H
Height
T
Thickness
LD
Lead Diameter
LL
Lead Length
Minimum
C052H
0.20±0.015
(5.08±0.38)
0.19±0.01
(4.83±0.25)
0.19±0.01
(4.83±0.25)
0.09±0.01
(2.29±0.25)
0.025+0.004/−0.002
(0.635+0.102/−0.051)
1.25 (31.75)
C062H
0.29±0.01
(7.37±0.25)
0.29±0.01
(7.37±0.25)
0.09±0.01
(2.29±0.25)
Benets
• Operating temperature range of −55°C to +200°C
• High shock and vibration capability
• Base Metal Electrode (BME) dielectric system
• RoHS and REACH compliant
• Radial through-hole form factor
• Gold (Au) plated wire lead nish
• Military designation styles CK/CKR05 and CK/CKR06
• Molded case
• High breakdown voltage strength
• DC voltage ratings of 50 V, 100 V and 200 V
• Capacitance offerings ranging from 1.0 pF up to 0.22 μF
• Available capacitance tolerances of ±0.1 pF, ±0.25 pF, ±0.5
pF, ±1%, ±2%, ±5%, and ±10%
• Extremely low ESR and ESL
• High thermal stability
• High ripple current capability
• No capacitance change with respect to applied rated DC
voltage
• Negligible capacitance change with respect to temperature
from −55°C to +200°C
• No capacitance decay with time
• Non-polar device, minimizing installation concerns
• Encapsulation meets ammability standard UL 94V–0
• Halogen-free
Applications
Typical applications include critical timing, tuning, circuits requiring low loss, circuits with pulse, high current, decoupling,
bypass, ltering, transient voltage suppression, blocking and energy storage, circuits with a direct battery or power source
connection, critical and safety relevant circuits without (integrated) current limitation and any application that is subject to
extreme environments such as high shock and vibration, high temperature, high levels of board exure and/or temperature
cycling. Programs supported include down-hole exploration, aerospace engine compartments, geophysical probes, hybrid
and electric automotive motor drives and defense. Markets include military, industrial, aerospace, and automotive.