Datasheet
11© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1087_U2J_FT-CAP_SMD • 11/8/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
Terminal Strength JIS–C–6429 Appendix 1, Note:
Board Flex JIS–C–6429 Appendix 2, Note: 3.0 mm (minimum)
Solderability J–STD–002
Magnication 50 X Conditions:
a) Method B, 4 hours at 155°C, dry heat at 235°C
b) Method B, at 215°C, category 3
c) Method D, at 260°C, category 3
Temperature Cycling JESD22 Method JA-104 1,000 cycles (−55°C to +125°C). Measurement at 24 hours ±4 hours after test conclusion.
Biased Humidity MIL-STD-202 Method 103
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor.
Measurement at 24 hours ±4 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85C°/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours ±4 hours after test conclusion.
Moisture Resistance MIL-STD-202 Method 106
t = 24 hours/cycle. Steps 7a and 7b not required. Measurement at 24 hours ±4 hours after
test conclusion.
Thermal Shock MIL-STD-202 Method 107
−55°C/+125°C. Note: Number of cycles required – 300. Maximum transfer time – 20
seconds. Dwell time – 15 minutes. Air – air.
High Temperature Life
MIL-STD-202
Method 108/EIA -198
1,000 hours at 125°C with 2 X rated voltage applied.
Storage Life MIL-STD-202 Method 108 125°C, 0 VDC for 1,000 hours.
Vibration MIL-STD-202 Method 204
5 G's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick
7 secure points on one long side and 2 secure points at corners of opposite sides. Parts
mounted within 2" from any secure point. Test from 10 – 2,000 Hz
Mechanical Shock MIL-STD-202 Method 213 Figure 1 of Method 213, Condition F.
Resistance to Solvents MIL-STD-202 Method 215 Add aqueous wash chemical, OKEM clean or equivalent.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp,
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum
storage humidity not exceed 70% relative humidity. Temperature uctuations should be minimized to avoid condensation on
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
Package Size (L" x W") Force Duration
0402
5 N (0.51 kg)
60 seconds
0603
10 N (1.02 kg)
≥ 0805
18 N (1.83 kg)