Datasheet

12© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1011_X7R_TIP_RING_SMD • 12/17/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Telecom Tip & Ring, X7R Dielectric, 250 VDC (Commercial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
TerminalStrength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Board Flex JIS–C–6429
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm
for C0G. Flexible termination system – 3.0 mm (minimum).
Solderability J–STD–002
Magnication50X,conditions:
a)MethodB,4hoursat155°C,dryheatat235°C
b)MethodBcategory3at215°C
c)MethodD,category3at260°C
Temperature Cycling JESD22MethodJA–104 1,000Cycles(−55°Cto+125°C).Measurementat24hours±4hoursaftertestconclusion.
Biased Humidity
MIL–STD–202
Method103
Loadhumidity:1,000hours85°C/85%RHandratedvoltage.Add100Kohmresistor.
Measurementat24hours±4hoursaftertestconclusion.
Lowvolthumidity:1,000hours85°C/85%RHand1.5V.Add100Kohmresistor.
Measurementat24hours±4hoursaftertestconclusion.
Moisture Resistance
MIL–STD–202
Method106
t=24hours/cycle.Steps7aand7bnotrequired.
Measurementat24hours±4hoursaftertestconclusion.
ThermalShock
MIL–STD–202
Method107
−55°C/+125°C.Note:Numberofcyclesrequired–300.Maximumtransfertime–20
seconds. Dwell time – 15 minutes. Air – air.
HighTemperatureLife
MIL–STD–202
Method108/EIA–198
1,000hoursat125°C(85°CforX5R,Z5UandY5V)with2Xratedvoltageapplied.
Storage Life
MIL–STD–202
Method108
150°C,0VDCfor1,000hours.
Vibration
MIL–STD–202
Method204
5g'sfor20minutes,12cycleseachof3orientations.Note:Use8"X5"PCB0.031"thick
7 secure points on one long side and 2 secure points at corners of opposite sides. Parts
mountedwithin2"fromanysecurepoint.Testfrom10–2,000Hz
MechanicalShock
MIL–STD–202
Method213
Figure1ofMethod213,ConditionF.
Resistance to Solvents
MIL–STD–202
Method215
Addaqueouswashchemical,OKEMCleanorequivalent.
Storage & Handling
Ceramicchipcapacitorsshouldbestoredinnormalworkingenvironments.Whilethechipsthemselvesarequiterobustin
otherenvironments,solderabilitywillbedegradedbyexposuretohightemperatures,highhumidity,corrosiveatmospheres,
andlongtermstorage.Inaddition,packagingmaterialswillbedegradedbyhightemperature–reelsmaysoftenorwarp
andtapepeelforcemayincrease.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40°Candmaximum
storagehumiditynotexceed70%relativehumidity.Temperatureuctuationsshouldbeminimizedtoavoidcondensationon
thepartsandatmospheresshouldbefreeofchlorineandsulfurbearingcompounds.Foroptimizedsolderabilitychipstock
shouldbeusedpromptly,preferablywithin1.5yearsofreceipt.