Datasheet

ManualsBrandsKEMET ManualsCapacitorsCeramic Capacitor 1nF 1kV 0805 X7R

1© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1025_X7R_HV_FT-CAP_SMD • 12/19/2018

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

One world. One KEMET

Overview

KEMET’s High Voltage with Flexible Termination (HV FT-CAP)

surface mount MLCCs in X7R dielectric address the primary

failure mode of MLCCs– ex cracks, which are typically the

result of excessive tensile and shear stresses produced

during board exure and thermal cycling. Featuring several

of the highest CV (capacitance/voltage) values available in

the industry, these devices utilize a pliable and conductive

silver epoxy between the base metal and nickel barrier layers

of the termination system. The addition of this epoxy layer

inhibits the transfer of board stress to the rigid ceramic

body, therefore mitigating ex cracks which can result in

low IR or short circuit failures. Although exible termination

technology does not eliminate the potential for mechanical

damage that may propagate during extreme environmental

and handling conditions, it does provide superior ex

performance over standard termination systems.

The HV FT-CAP offers low leakage current, exhibits low ESR

at high frequencies and nds conventional use as snubbers

or lters in applications such as switching power supplies

and lighting ballasts. Their exceptional performance at high

frequencies has made them a preferred choice of design

engineers worldwide. In addition to their use in power

supplies, these capacitors are widely used in industries

related to automotive(hybrid), telecommunications, medical,

military, aerospace, semiconductors and test/diagnostic

equipment.

Combined with the stability of an X7R dielectric and designed

to accommodate all capacitance requirements, these ex-

robust devices are RoHS-compliant, offer up to 5 mm of

ex-bend capability and exhibits a predictable change in

capacitance with respect to time and voltage. Capacitance

change with reference to ambient temperature is limited to

±15% from −55°C to +125°C.

In addition to Commercial Grade, Automotive Grade devices are

available which meet the demanding Automotive Electronics

Council's AEC-Q200 qualication requirements.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP)

X7R Dielectric, 500 – 3,000 VDC (Commercial Grade)

Ordering Information

C 1210 X 154 K C R A C TU

Ceramic

Case Size

(L" x W")

Specication/

Series

Capacitance

Code (pF)

Capacitance

Tolerance

Rated Voltage

(VDC)

Dielectric

Failure Rate/

Design

Termination Finish

Packaging/

Grade (C-Spec)

0603

0805

1206

1210

1808

1812

1825

2220

2225

X = Flexible

Termination

Two

signicant

digits and

number of

zeros.

J = ±5%

K = ±10%

M = ±20%

C = 500

B = 630

D = 1,000

F = 1,500

G = 2,000

Z = 2,500

H = 3,000

R = X7R A = N/A C = 100% Matte Sn

L = SnPb

(5% Pb minimum)

See

"Packaging

C-Spec

Ordering

Options Table"

Additional termination nish options may be available. Contact KEMET for details.

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Summary of content (22 pages)

PAGE 1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage with Flexible Termination System (HV FT-CAP) X7R Dielectric, 500 – 3,000 VDC (Commercial Grade) Overview KEMET’s High Voltage with Flexible Termination (HV FT-CAP) surface mount MLCCs in X7R dielectric address the primary failure mode of MLCCs– flex cracks, which are typically the result of excessive tensile and shear stresses produced during board flexure and thermal cycling.
PAGE 2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade) Packaging C-Spec Ordering Options Table Packaging Type1 Bulk Bag/Unmarked 7" Reel/Unmarked 13" Reel/Unmarked 7" Reel/Marked 13" Reel/Marked 7" Reel/Unmarked/2mm pitch2 13" Reel/Unmarked/2mm pitch2 Packaging/Grade Ordering Code (C-Spec) Not required (Blank) TU 7411 (EIA 0603 and smaller case sizes) 7210 (EIA 0805 and larger case sizes) TM 7040 (EIA 0
PAGE 3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade) Dimensions – Millimeters (Inches) L W B T S EIA Size Code Metric Size Code L Length W Width 0603 1608 0805 2012 1206 3216 1210 3225 1808 4520 1812 4532 1825 4564 2220 5650 2225 5664 1.60 (0.063) ±0.17 (0.007) 2.00 (0.079) ±0.30 (0.012) 3.30 (0.130) ±0.40 (0.016) 3.30 (0.130) ±0.40 (0.016) 4.70 (0.185) ±0.50 (0.020) 4.50 (0.
PAGE 4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade) Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range −55°C to +125°C Capacitance Change with Reference to +25°C and 0 Vdc Applied (TCC) ±15% Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.
PAGE 5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade) Table 1A – Capacitance Range/Selection Waterfall (0603 – 1812 Case Sizes) 500 630 1000 1500 2000 500 630 1000 1500 2000 2500 3000 500 630 1000 2500 1500 2000 3000 630 DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG D
PAGE 6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade) Table 1A – Capacitance Range/Selection Waterfall (0603 – 1812 Case Sizes) cont'd B D F G C B D F G Z H C B D 630 1500 2000 500 630 1000 1500 2000 500 630 1000 1500 2000 2500 3000 500 630 1000 F G Z H 2500 C 3000 G 2500 F 3000 D 1500 B 2000 C 1500 D 2000 B 1000 C1812X 500 C1808X 1000 500 C1210
PAGE 7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade) Table 1B – Capacitance Range/Selection Waterfall (1825 – 2225 Case Sizes) JK JK JK JK JK JK JK JK JE JE JE JE JK JK JK JK JL JL JN JN JN JK JK JK JK JK JK JK JK JK JK JK JK JE JE JE JK JL JL JN JK JK JK JK JK JK JK JK JK JK JE JE JE JE JE JK JL JL JN Rated Voltage (VDC) 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 Voltage Code
PAGE 8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade) Table 2A – Chip Thickness/Tape & Reel Packaging Quantities Paper Quantity1 Plastic Quantity Thickness Code Case Size1 Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel CG DG ES EF EU EJ FZ FL FU FM FK FS LE LA LB LC GB GC GE GH GF GG GK GJ GN GL GM GS GO HE HG HJ HK JE JK JL JN KE KF KH KJ 0603 0805 1206 1206 1206 1206 1210 1210 1210
PAGE 9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade) Table 2B – Bulk Packaging Quantities Loose Packaging Packaging Type Bulk Bag (default) Packaging C-Spec1 N/A 2 Case Size Packaging Quantities (pieces/unit packaging) EIA (in) Metric (mm) 0402 0603 0805 1206 1210 1808 1005 1608 2012 3216 3225 4520 1812 1825 2220 2225 4532 4564 5650 5664 Minimum Maximum 50,000 1 20,000 The "Packaging C-
PAGE 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade) Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 EIA Size Code Metric Size Code 0603 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 1608 0.85 1.25 1.
PAGE 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade) Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, I
PAGE 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds. Board Flex JIS–C–6429 Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G. Flexible termination system – 3.
PAGE 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade) Construction Detailed Cross Section Dielectric Material (BaTiO3) Barrier Layer End Termination/ (Ni) External Electrode Termination Finish (Cu) (100% Matte Sn / Epoxy Layer SnPb - 5% Pb min) (Ag) Dielectric Material (BaTiO3) Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Epoxy Layer (Ag) Barrier Layer (Ni) Inner Electrodes (Ni) © KEM
PAGE 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade) Capacitor Marking (Optional): These surface mount multilayer ceramic capacitors are normally supplied unmarked. If required, they can be marked as an extra cost option. Marking is available on most KEMET devices, but must be requested using the correct ordering code identifier(s).
PAGE 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade) Capacitor Marking (Optional) cont’d Capacitance (pF) For Various Alpha/Numeral Identifiers Numeral Alpha Character 9 A 0.10 1.0 10 100 1,000 10,000 B 0.11 1.1 11 110 1,100 11,000 C 0.12 1.2 12 120 1,200 12,000 D 0.13 1.3 13 130 1,300 E 0.15 1.
PAGE 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips.
PAGE 17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØD0 (10 pitches cumulative tolerance on tape ±0.2 mm) P0 A0 E1 F K0 B1 E2 B0 S1 W P1 T1 Center Lines of Cavity ØD1 Cover Tape B1 is for tape feeder reference only, including draft concentric about B0.
PAGE 18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions T Po ØDo (10 pitches cumulative tolerance on tape ±0.
PAGE 19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.
PAGE 20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade) Figure 6 – Reel Dimensions Full Radius, See Note W3 (Includes flange distortion at outer edge) Access Hole at Slot Location (Ø 40 mm minimum) W2 D A (See Note) N C (Arbor hole diameter) B (see Note) (Measured at hub) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.
PAGE 21
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade) Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier 8 mm & 12 mm only END Carrier Tape Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm minimum Components 100 mm minimum leader 400 mm minimum Top Cover Tape Figure 8 – Maximum Camber Elongated Sprocket Holes (32 m
PAGE 22
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage with Flexible Termination System, X7R Dielectric, 500 – 3,000 VDC (Commercial Grade) KEMET Electronics Corporation Sales Oﬃces For a complete list of our global sales oﬃces, please visit www.kemet.com/sales. Disclaimer All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change.