Datasheet

ManualsBrandsKEMET ManualsCapacitorsCeramic Capacitor 100pF 1kV 1206 C0G

1© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1009_C0G_HV_SMD • 4/22/2019

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

One world. One KEMET

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage C0G Dielectric, 500 – 10,000 VDC

(Commercial Grade)

Benets

• Operatingtemperaturerangeof−55°Cto+125°C

• Capacitanceofferingsrangingfrom1pFto0.15μF

• DC voltage ratings of 500 V, 630 V, 1 KV, 1.5 KV, 2 KV, 2.5 KV,

3 KV and 10KV

• EIA 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2220, 2225,

2824, 3040, 3640 and 4540 case sizes

• Extremely low ESR and ESL

• High ripple current capability

• No capacitance shift with voltage

• Negligible capacitance shift with respect to temperature

• No piezoelectric noise

• Lead (Pb)-Free, RoHS and REACH compliant

Applications

• High frequency power converters

• Wide bandgap (WBG), silicon carbide (SiC) and gallium nitride (GaN) systems

• Snubber (high dV/dT)

• Resonant circuits (LLC, Wireless Charging, etc)

• Timing

• Filtering

Overview

KEMET’s High Voltage surface mount MLCCs in C0G

dielectric are temperature compensating and are suited for

resonant circuit applications or those where Q and stability

of capacitance characteristics are required. C0G exhibits

no change in capacitance with respect to time and voltage

and boasts a negligible change in capacitance with

reference to ambient temperature. Capacitance change is

limitedto±30ppm/°Cfrom−55°Cto+125°C.

These devices exhibit low ESR at high frequencies and

ndconventionaluseassnubbersorltersinapplications

such as switching power supplies and lighting ballasts.

Their exceptional performance at high frequencies has

made C0G high voltage the preferred dielectric choice of

design engineers worldwide. In addition to Commercial

Grade, Automotive Grade devices are available which meet

the demanding Automotive Electronics Council's

AEC–Q200qualicationrequirements.

Click image above for interactive 3D content

Open PDF in Adobe Reader for full functionality

Summary of content (23 pages)

PAGE 1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade) Overview KEMET’s High Voltage surface mount MLCCs in C0G dielectric are temperature compensating and are suited for resonant circuit applications or those where Q and stability of capacitance characteristics are required. C0G exhibits no change in capacitance with respect to time and voltage and boasts a negligible change in capacitance with reference to ambient temperature.
PAGE 2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade) Ordering Information C 1210 Ceramic 2 332 Case Size Specification/ Capacitance (L" x W") Series Code (pF) 0603 0805 1206 1210 1808 1812 1825 2220 2225 2824 3040 3640 4540 1 C C = Standard Two significant digits and number of zeros. J Capacitance Tolerance1 B = ±0.10 pF C = ±0.25 pF D = ±0.
PAGE 3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade) Dimensions – Millimeters (Inches) L W B T S EIA Size Code Metric Size Code 0603 1608 0805 2012 1206 3216 1210 3225 1808 4520 1812 4532 1825 4564 2220 5650 2225 5664 2824 7260 3040 7610 3640 9210 4540 - L Length W Width 1.60 (0.063) ±0.15 (0.006) 2.00 (0.079) ±0.20 (0.008) 3.20 (0.126) ±0.20 (0.008) 3.20 (0.126) ±0.20 (0.008) 4.70 (0.185) ±0.50 (0.
PAGE 4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade) Qualification/Certification Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance & Reliability. Environmental Compliance Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).
PAGE 5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade) Dielectric Withstanding Voltage (DWV) EIA Case Size 500V 630V 0603 130% of rated voltage 0805 1206 1210 1808 ≥ 1000V 150% of rated voltage 1812 1825 2220 2225 < 620pF 150% of rated voltage ≥ 620pF 130% of rated voltage < 5.1nF 150% of rated voltage ≥ 5.1nF 130% of rated voltage < 7.5nF 150% of rated voltage ≥ 7.5nF 130% of rated voltage < 5.1nF 150% of rated voltage ≥ 5.
PAGE 6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade) Table 1A – Capacitance Range/Selection Waterfall (0603 – 1808 Case Sizes) G Z H 3000 F 2500 D 2000 B 1500 C 1000 500 G 630 1000 F 500 630 D LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LA LA LA LA LA LA LA LA LA LA LA LA LA LA LA LA LA LA LB LB LB LB LB LC LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB
PAGE 7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade) Table 1A – Capacitance Range/Selection Waterfall (0603 – 1808 Case Sizes) cont'd 2500 3000 3000 B D C B D C B D F G C B D F G C B D F G Z H G G G G G G G G G G G G G G G G G G G G G G G G G G G G G J J J J J J J J J J J J J J J J J J J J J J J J J J J J J K K K K K K K K K K K K K K K K K K K K K K K K K K K K K Case Size/Series M M M M M M M M M M M M M
PAGE 8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade) Table 1B – Capacitance Range/Selection Waterfall (1812 – 2225 Case Sizes) 1000 1500 2000 2500 3000 10000 GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GD GD GD GD GD GD GD GD GD GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GD GD GD GD GD GD GD GD GD GB GB GB GB GB GB GB GB GB GD GD
PAGE 9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade) Table 1B – Capacitance Range/Selection Waterfall (1812 – 2225 Case Sizes) cont'd C1812C D F G Z H C B D F G Z H K 500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000 10000 D F G Z C1825C JK JK JK JE JE JE JE JK JK JL JL JL JN JN JN JK JN KE KE KE KF KE KF KJ JK KE KE KE KF KF KF JL KE KE KE KF
PAGE 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade) Table 1C – Capacitance Range/Selection Waterfall (2824 – 4540 Case Sizes) Case Size/Series 2000 SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SB SB SC SA SA SA SA SA SA SA SA SA SA SA SA SA SA SB SB SC SA SA SA SA SA SA SA SA SA SA SA SB SB SB SC SA SA SA SA SA SA SB SB SB SC SA SA SA SA SB SB SB SC 2000 G 1500 F 1500 D 1000 F B 1000 D C 630 B G 630 C F 50
PAGE 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade) Table 2A – Chip Thickness/Tape & Reel Packaging Quantities Paper Quantity Plastic Quantity Thickness Code Case Size Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel CG DN DP DG EB EC ED EE EF EG EH FE FF FG FL FM FY FK FS LA LB LC GB GD GH GK GM GO HE HG HJ HK JE JK JL JN KE KF KH KJ TA TB TC QB QC QD MA MB MC SA SB SC 0603 0805 0805 0805 1206 1206 1206 1206 1206 1
PAGE 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade) Table 2B – Bulk Packaging Quantities Loose Packaging Packaging Type Bulk Bag (default) Packaging C-Spec1 N/A 2 Case Size Packaging Quantities (pieces/unit packaging) EIA (in) Metric (mm) 0603 0805 1206 1210 1808 1812 1608 2012 3216 3225 4520 4532 1825 2220 2225 4564 5650 5664 Minimum Maximum 50,000 1 20,000 The "Packaging C-Spec" is a 4 to 8 digit code which identifi
PAGE 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade) Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 EIA Size Code Metric Size Code 0603 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.
PAGE 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade) Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow technique
PAGE 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds. Board Flex JIS–C–6429 Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G. Flexible termination system – 3.0 mm (minimum). Magnification 50 X.
PAGE 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade) Construction Detailed Cross Section Dielectric Material (CaZrO3) Barrier Layer (Ni) Termination Finish (100% Matte Sn / SnPb - 5% Pb min) Dielectric Material (CaZrO3) End Termination/ External Electrode (Cu) Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Barrier Layer (Ni) Termination Finish (100% Matte Sn / SnPb - 5% Pb min) Inner Electrodes (Ni) Capacitor Mark
PAGE 17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12, 16 and 24 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips.
PAGE 18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØD0 P0 (10 pitches cumulative tolerance on tape ±0.2 mm) A0 E1 F K0 B1 E2 B0 S1 W P1 T1 Center Lines of Cavity ØD1 Cover Tape B1 is for tape feeder reference only, including draft concentric about B0.
PAGE 19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions T Po ØDo (10 pitches cumulative tolerance on tape ±0.
PAGE 20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf) 24 mm 0.1 to 1.
PAGE 21
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade) Figure 6 – Reel Dimensions Full Radius, See Note W3 (Includes flange distortion at outer edge) Access Hole at Slot Location (Ø 40 mm minimum) W2 D A (See Note) N C (Arbor hole diameter) B (see Note) (Measured at hub) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.
PAGE 22
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade) Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier 8 mm & 12 mm only END Carrier Tape Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm minimum Components 100 mm minimum leader 400 mm minimum Top Cover Tape Figure 8 – Maximum Camber Elongated Sprocket Holes (32 mm & wider tapes) Carrier Tape R
PAGE 23
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500 – 10,000 VDC (Commercial Grade) KEMET Electronics Corporation Sales Oﬃces For a complete list of our global sales oﬃces, please visit www.kemet.com/sales. Disclaimer All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change.