Datasheet

ManualsBrandsKEMET ManualsCapacitorsCeramic Capacitor 4.7uF, 10VDC, 1206, ±10 %

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Benets

• −55°Cto+85°Coperatingtemperaturerange

• Lead (Pb)-Free, RoHS and REACH compliant

• Temperaturestabledielectric

• EIA 0201, 0402, 0603, 0805, 1206, 1210, and 1812 case sizes

• DCvoltageratingsof4V,6.3V,10V,16V,25V,35V,and50V

• Capacitanceofferingsrangingfrom0.01μFto100μF

• Availablecapacitancetolerancesof±10%and±20%

• Non-polardevice,minimizinginstallationconcerns

• 100%puremattetin-platedterminationnishallowingfor

excellent solderability

Applications

Typicalapplicationsincludedecoupling,bypass,andltering.

Overview

KEMET’sX5Rdielectricfeaturesan85°Cmaximum

operatingtemperatureandisconsidered“semi-stable.”The

Electronics Components, Assemblies & Materials Association

(EIA)characterizesX5RdielectricasaClassIImaterial.

Componentsofthisclassicationarexed,ceramicdielectric

capacitorssuitedforbypassanddecouplingapplications

orforfrequencydiscriminatingcircuitswhereQandstability

ofcapacitancecharacteristicsarenotcritical.X5Rexhibitsa

predictablechangeincapacitancewithrespecttotimeand

voltageandboastsaminimalchangeincapacitancewith

referencetoambienttemperature.Capacitancechangeislimited

to±15%from−55°Cto+85°C.

SurfaceMountMultilayerCeramicChipCapacitors(SMDMLCCs)

X5R Dielectric, 4 – 50 VDC (Commercial Grade)

Ordering Information

C 1206 C 107 M 9 P A C TU

Ceramic

Case Size

(L" x W")

Specication/

Series

Capacitance

Code (pF)

Capacitance

Tolerance

RatedVoltage

(VDC)

Dielectric

FailureRate/

Design

Termination

Finish

Packaging/Grade

(C–Spec)

0201

0402

0603

0805

1206

1210

C = Standard Two

signicant

digits+

numberof

zeros.

K=±10%

M=±20%

7 = 4

9 = 6.3

8 = 10

4 = 16

3 = 25

6 = 35

5 = 50

P = X5R A = N/A C=100%

Matte Sn

See"Packaging

C-SpecOrdering

Options Table"

below

Additional termination nish options may be available. Contact KEMET for details.

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Summary of content (22 pages)

PAGE 1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X5R Dielectric, 4 – 50 VDC (Commercial Grade) Overview KEMET’s X5R dielectric features an 85°C maximum operating temperature and is considered “semi-stable.” The Electronics Components, Assemblies & Materials Association (EIA) characterizes X5R dielectric as a Class II material.
PAGE 2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Packaging C-Spec Ordering Options Table Packaging/Grade Ordering Code (C-Spec) Packaging Type1 Bulk Bag / Unmarked 7" Reel / Unmarked 13" Reel / Unmarked 7" Reel / Marked 13" Reel / Marked 7" Reel / Unmarked / 2mm pitch2 13" Reel / Unmarked / 2mm pitch2 Not required (Blank) TU 7411 (EIA 0603 and smaller case sizes) 7210 (EIA 0805 and larger case sizes) TM 7040 (EIA 0603 and smaller case sizes) 721
PAGE 3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Qualification/Certification Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance & Reliability. Environmental Compliance Lead (Pb)-Free, RoHS, and REACH compliant without exemptions.
PAGE 4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Dissipation Factor Limit Table Rated DC Voltage Capacitance Dissipation Factor (Maximum %) > 25 All 2.5 < 2.2 µF 5.0 ≥ 2.2 µF 10.0 < 0.56 µF 5.0 ≥ 0.56 µF 10.0 25 < 25 Insulation Resistance Limit Table EIA Case Size 1,000 Megohm Microfarads or 100 GΩ 500 Megohm Microfarads or 10 GΩ 100 Megohm Microfarads 0201 N/A ALL N/A 0402 < .012 µF ≥ .012 µF < 1.0 µF ≥ 1.
PAGE 5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Table 1 – Capacitance Range/Selection Waterfall (0201 – 0805 Case Sizes) 8 4 3 5 7 9 8 4 3 5 7 9 8 4 3 5 10 16 25 50 4 6.3 10 16 25 50 4 6.3 10 16 25 50 AB 9 6.
PAGE 6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Table 1 – Capacitance Range/Selection Waterfall (1206 – 1812 Case Sizes) 3 6 5 3 6.
PAGE 7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Table 2A – Chip Thickness/Tape & Reel Packaging Quantities Thickness Code Case Size1 Thickness ± Range (mm) AB BB BE BF CG CJ DN DP DL DE DF DG DH EB EK EC ED EE EF EP EH FD FE FF FG FH FJ FT FK FS GK 0201 0402 0402 0402 0603 0603 0805 0805 0805 0805 0805 0805 0805 1206 1206 1206 1206 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1210 1210 1812 0.30 ± 0.03 0.50 ± 0.05 0.50 ± 0.15 0.
PAGE 8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Table 2B – Bulk Packaging Quantities Loose Packaging Packaging Type Bulk Bag (default) Packaging C-Spec N/A 2 Case Size Packaging Quantities (pieces/unit packaging) 1 EIA (in) Metric (mm) 0402 0603 0805 1206 1210 1808 1812 1825 2220 2225 1005 1608 2012 3216 3225 4520 4532 4564 5650 5664 Minimum Maximum 50,000 1 20,000 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the
PAGE 9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 EIA Size Code Metric Size Code 0201 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 0603 0.38 0.56 0.52 1.80 1.00 0.33 0.46 0.42 1.50 0.80 0.
PAGE 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques.
PAGE 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds. Board Flex JIS–C–6429 Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G. Flexible termination system – 3.0 mm (minimum). Magnification 50 X.
PAGE 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Construction (Typical) Detailed Cross Section Dielectric Material (BaTiO3) Barrier Layer (Ni) Termination Finish (100% Matte Sn) Dielectric Material (BaTiO3) End Termination/ External Electrode (Cu) Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Barrier Layer (Ni) Termination Finish (100% Matte Sn) Inner Electrodes (Ni) © KEMET Electronics Corporation • P.O.
PAGE 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Capacitor Marking (Optional): These surface mount multilayer ceramic capacitors are normally supplied unmarked. If required, they can be marked as an extra cost option. Marking is available on most KEMET devices but must be requested using the correct ordering code identifier(s).
PAGE 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Capacitor Marking (Optional) cont’d Alpha Character 9 A Capacitance (pF) For Various Alpha/Numeral Identifiers Numeral 0 1 2 3 4 0.1 10 10 100 1,000 10,000 B 0.11 1.1 11 110 1,100 11,000 C 0.12 12 12 120 1,200 12,000 D 0.13 13 13 130 1,300 E 0.
PAGE 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips.
PAGE 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØDo [10 pitches cumulative tolerance on tape ± 0.2 mm] Po E1 Ao F Ko B1 E2 Bo S1 W P1 T1 Center Lines of Cavity ØD 1 Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o.
PAGE 17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions P2 T Po ØDo [10 pitches cumulative tolerance on tape ± 0.
PAGE 18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 Newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel.
PAGE 19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Figure 6 – Reel Dimensions Full Radius, See Note W3 (Includes Access Hole at Slot Location (Ø 40 mm minimum) flange distortion at outer edge) W2 (Measured at hub) D A (See Note) N C (Arbor hole diameter) B (see Note) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.
PAGE 20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Carrier Tape Punched Carrier 8 mm & 12 mm only END Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm Minimum Components 100 mm Minimum Leader 400 mm Minimum Top Cover Tape Figure 8 – Maximum Camber Elongated sprocket holes (32 mm & wider tapes) Carrier Tape Round Sprocket Ho
PAGE 21
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) KEMET Corporation World Headquarters Europe Asia Southern Europe Sasso Marconi, Italy Tel: 39-051-939111 Northeast Asia Hong Kong Tel: 852-2305-1168 Mailing Address: P.O. Box 5928 Greenville, SC 29606 Skopje, Macedonia Tel: 389-2-55-14-623 Shenzhen, China Tel: 86-755-2518-1306 www.kemet.
PAGE 22
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Disclaimer All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.