Datasheet

13© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1080_C0G_HV_AUTO_SMD • 4/16/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 3,000 VDC (Automotive Grade)
Soldering Process
Recommended Soldering Technique:
 •SolderwaveorsolderreowforEIAcasesizes0603,0805and1206
 •AllotherEIAcasesizesarelimitedtosolderreowonly
Recommended Reow Soldering Prole:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection,IRorvaporphasereowtechniques.Preheatingofthesecomponentsisrecommendedtoavoidextremethermal
stress.KEMET’srecommendedproleconditionsforconvectionandIRreowreecttheproleconditionsoftheIPC/J-
STD-020standardformoisturesensitivitytesting.Thesedevicescansafelywithstandamaximumofthreereowpassesat
these conditions.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum
storagehumiditynotexceed70%relativehumidity.Temperatureuctuationsshouldbeminimizedtoavoidcondensationon
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
Prole Feature
Termination Finish
SnPb 100% Matte Sn
Preheat/Soak
Temperature Minimum (T
Smin
)
100°C
150°C
Temperature Maximum (T
Smax
) 150°C 200°C
Time (t
S
) from T
Smin
to T
Smax
60 – 120 seconds
60 – 120 seconds
Ramp-Up Rate (T
L
to T
P
)
3°C/second
maximum
3°C/second
maximum
Liquidous Temperature (T
L
) 183°C 217°C
Time Above Liquidous (t
L
) 60 – 150 seconds 60 – 150 seconds
Peak Temperature (T
P
) 235°C 260°C
TimeWithin5°CofMaximum
Peak Temperature (t
P
)
20 seconds
maximum
30 seconds
maximum
Ramp-Down Rate (T
P
to T
L
)
6°C/second
maximum
6°C/second
maximum
Time25°CtoPeak
Temperature
6 minutes
maximum
8 minutes
maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reow.
Time
Temperature
T
smin
25
T
smax
T
L
T
P
Maximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
t
P
t
L
t
s
25°C to Peak