Datasheet

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com C1003_C0G • 3/30/2016 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Commercial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
TerminalStrength JIS–C–6429 Appendix1,Note:Forceof1.8kgfor60seconds.
Board Flex JIS–C–6429
Appendix2,Note:Standardterminationsystem–2.0mm(minimum)forallexcept3mmforC0G.
Flexibleterminationsystem–3.0mm(minimum).
Solderability J–STD–002
Magnication50X.Conditions:
a)MethodB,4hours@155°C,dryheat@235°C
b)MethodB@215°Ccategory3
c)MethodD,category3@260°C
TemperatureCycling JESD22MethodJA–104 1,000Cycles(−55°Cto+125°C).Measurementat24hours+/-4hoursaftertestconclusion.
BiasedHumidity MIL–STD–202Method103
LoadHumidity:1,000hours85°C/85%RHandratedvoltage.Add100Kohmresistor.Measurement
at24hours+/-4hoursaftertestconclusion.
LowVoltHumidity:1,000hours85°C/85%RHand1.5V.Add100Kohmresistor.
Measurementat24hours+/-4hoursaftertestconclusion.
MoistureResistance MIL–STD–202Method106
t=24hours/cycle.Steps7aand7bnotrequired.
Measurementat24hours+/-4hoursaftertestconclusion.
ThermalShock MIL–STD–202Method107
−55°C/+125°C.Note:Numberofcyclesrequired–300,maximumtransfertime–20seconds,dwell
time–15minutes.Air–Air.
HighTemperatureLife
MIL–STD–202Method108
/EIA–198
1,000hoursat125°C(85°CforX5R,Z5UandY5V)with2Xratedvoltageapplied.
StorageLife MIL–STD–202Method108 150°C,0VDCfor1,000hours.
Vibration MIL–STD–202Method204
5g'sfor20min.,12cycleseachof3orientations.Note:Use8"X5"PCB0.031"thick7secure
pointsononelongsideand2securepointsatcornersofoppositesides.Partsmountedwithin2"
fromanysecurepoint.Testfrom10–2,000Hz
MechanicalShock MIL–STD–202Method213 Figure1ofMethod213,ConditionF.
Resistance to Solvents MIL–STD–202Method215 Addaqueouswashchemical,OKEMCleanorequivalent.
Storage and Handling
Ceramicchipcapacitorsshouldbestoredinnormalworkingenvironments.Whilethechipsthemselvesarequiterobustinother
environments,solderabilitywillbedegradedbyexposuretohightemperatures,highhumidity,corrosiveatmospheres,andlongterm
storage.Inaddition,packagingmaterialswillbedegradedbyhightemperature–reelsmaysoftenorwarpandtapepeelforcemay
increase.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40ºCandmaximumstoragehumiditynotexceed70%
relativehumidity.Temperatureuctuationsshouldbeminimizedtoavoidcondensationonthepartsandatmospheresshouldbefreeof
chlorineandsulfurbearingcompounds.Foroptimizedsolderabilitychipstockshouldbeusedpromptly,preferablywithin1.5yearsof
receipt.