Datasheet

ManualsBrandsKEMET ManualsCapacitorsCeramic Capacitor 1uF 50V 1206 X7R

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Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

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Overview

The KEMET Flexible Termination (FT-CAP) multilayer

ceramic capacitor in X7R dielectric incorporates a unique,

exible termination system that is integrated with the

KEMET standard termination materials. A conductive silver

epoxy is utilized between the base metal and nickel barrier

layers of KEMET’s standard termination system in order

to establish pliability, while maintaining terminal strength,

solderability and electrical performance. This technology

was developed in order to address the primary failure

mode of MLCCs – ex cracks, which are typically the result

of excessive tensile and shear stresses produced during

board exure and thermal cycling. Flexible termination

technology inhibits the transfer of board stress to the rigid

ceramic body, therefore mitigating ex cracks which can

result in low IR or short circuit failures.

Although this technology does not eliminate the potential

for mechanical damage that may propagate during extreme

environmental and handling conditions, it does provide

superior ex performance over standard termination

systems. FT-CAP complements the KEMET Open Mode,

Floating Electrode (FE-CAP), Floating Electrode with

Flexible Termination (FF-CAP) and KEMET Power Solutions

(KPS) product lines by providing a complete portfolio of ex

mitigation solutions.

Combined with the stability of an X7R dielectric and designed

to accommodate all capacitance requirements, these ex-

robust devices are RoHS-compliant, offer up to 5 mm of

ex-bend capability and exhibit a predictable change in

capacitance with respect to time and voltage. Capacitance

change with reference to ambient temperature is limited to

±15% from −55°C to +125°C.

In addition to commercial grade, automotive grade devices

are available which meet the demanding Automotive

Electronics Council's AEC–Q200 qualication requirements.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric,

6.3 – 250 VDC (Commercial Grade)

Ordering Information

C 1206 X 106 K 4 R A C TU

Ceramic

Case Size

(L" x W")

Specication/

Series

Capacitance

Code (pF)

Capacitance

Tolerance

Rated

Voltage

(VDC)

Dielectric

Failure

Rate/

Design

Termination Finish

Packaging/Grade

(C-Spec)

0603

0805

1206

1210

1808

1812

1825

2220

2225

X = Flexible

termination

Two

signicant

digits and

number of

zeros

J = ±5%

K = ±10%

M = ±20%

9 = 6.3

8 = 10

4 = 16

3 = 25

5 = 50

1 = 100

2 = 200

A = 250

R = X7R A = N/A C = 100% Matte Sn

L = SnPb (5% Pb minimum)

See "Packaging

C-Spec

Ordering

Options Table"

Additional termination nish options may be available. Contact KEMET for details.

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Summary of content (24 pages)

PAGE 1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade) Overview The KEMET Flexible Termination (FT-CAP) multilayer ceramic capacitor in X7R dielectric incorporates a unique, flexible termination system that is integrated with the KEMET standard termination materials.
PAGE 2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.
PAGE 3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade) Dimensions – Millimeters (Inches) L W B T S 1 2 EIA Size Code Metric Size Code 06031 1608 08052 2012 1206 3216 1210 3225 1808 4520 1812 4532 1825 4564 2220 5650 2225 5664 L Length W Width 1.60 (0.063) ±0.17 (0.007) 2.00 (0.079) ±0.30 (0.012) 3.30 (0.130) ±0.40 (0.016) 3.30 (0.130) ±0.40 (0.016) 4.70 (0.185) ±0.50 (0.020) 4.50 (0.
PAGE 4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade) Qualification/Certification Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance & Reliability. Environmental Compliance Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option.
PAGE 5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade) Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance EIA Case Size Rated DC Voltage Capacitance < 16 0603 16/25 0805 12061 1210 1808 - 2225 1 < 1.0 µF ±20% 10% of Initial limit 3.0 20.0 < 4.7 µF 7.5 ≥ 4.7 µF 20.0 < 4.7 µF 5.0 ≥ 4.7 µF 20.0 25 All 5.0 > 25 All 3.0 < 16 All 7.5 16/25 All 5.
PAGE 6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade) Insulation Resistance Limit Table EIA Case Size Rated DC Voltage 1,000 megohm microfarads or 100 GΩ 500 megohm microfarads or 10 GΩ 100 megohm microfarads or 10 GΩ 0402 1808 1812 ALL ≤ 200 V 250 V ≤ 200 V 250 V ≤ 200 V 250 V ≤ 200 V 250 V ALL ALL < 0.012 µF < 0.047 µF N/A < 0.15 µF < .027 µF < 0.47 µF < 0.12 µF < 0.39 µF < 0.27 µF ALL < 2.2 µF ≥ 0.
PAGE 7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.
PAGE 8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade) Table 1A – Capacitance Range/Selection Waterfall (0603 – 1210 Case Sizes) cont'd 250 A 250 5 2 100 3 1 200 5 100 3 200 4 25 8 50 9 25 A 50 2 16 1 10 5 6.3 3 250 4 100 8 C1210X 200 9 25 A 50 2 16 16 1 10 10 5 6.3 6.
PAGE 9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.
PAGE 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.
PAGE 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.
PAGE 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade) Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 EIA Size Code Metric Size Code 0603 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 1608 0.85 1.25 1.10 4.00 2.
PAGE 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.
PAGE 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds. Board Flex JIS–C–6429 Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G. Flexible termination system – 3.0 mm (minimum).
PAGE 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.
PAGE 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade) Capacitor Marking (Optional): These surface mount multilayer ceramic capacitors are normally supplied unmarked. If required, they can be marked as an extra cost option. Marking is available on most KEMET devices, but must be requested using the correct ordering code identifier(s).
PAGE 17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade) Capacitor Marking (Optional) cont’d Capacitance (pF) For Various Alpha/Numeral Identifiers Numeral Alpha Character 9 A 0.10 1.0 10 100 1,000 10,000 B 0.11 1.1 11 110 1,100 11,000 C 0.12 1.2 12 120 1,200 12,000 D 0.13 1.3 13 130 1,300 E 0.15 1.
PAGE 18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips.
PAGE 19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØD0 (10 pitches cumulative tolerance on tape ±0.2 mm) P0 A0 E1 F K0 B1 E2 B0 S1 W P1 T1 Center Lines of Cavity ØD1 Cover Tape B1 is for tape feeder reference only, including draft concentric about B0.
PAGE 20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions T Po ØDo (10 pitches cumulative tolerance on tape ±0.
PAGE 21
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.
PAGE 22
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade) Figure 6 – Reel Dimensions Full Radius, See Note W3 (Includes flange distortion at outer edge) Access Hole at Slot Location (Ø 40 mm minimum) W2 D A (See Note) N C (Arbor hole diameter) B (see Note) (Measured at hub) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.
PAGE 23
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.
PAGE 24
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Commercial Grade) KEMET Electronics Corporation Sales Oﬃces For a complete list of our global sales oﬃces, please visit www.kemet.com/sales. Disclaimer All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change.