Datasheet

11© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1006_X5R_SMD • 11/9/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X5R Dielectric, 4 – 50 VDC (Commercial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
TerminalStrength JIS–C–6429 Appendix1,Note:Forceof1.8kgfor60seconds.
Board Flex JIS–C–6429
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for
C0G.Flexibleterminationsystem–3.0mm(minimum).
Solderability J–STD–002
Magnication50X.Conditions:
a)MethodB,4hoursat155°C,dryheatat235°C
b)MethodBat215°Ccategory3
c)MethodD,category3at260°C
TemperatureCycling JESD22MethodJA–104 1,000Cycles(−55°Cto+125°C).Measurementat24hours+/−4hoursaftertestconclusion.
Biased Humidity
MIL–STD–202Method
103
LoadHumidity:1,000hours85°C/85%RHandratedvoltage.Add100Kohmresistor.
Measurementat24hours+/−4hoursaftertestconclusion.
LowVoltHumidity:1,000hours85°C/85%RHand1.5V.Add100Kohmresistor.
Measurementat24hours+/−4hoursaftertestconclusion.
Moisture Resistance
MIL–STD–202Method
106
t=24hours/cycle.Steps7aand7bnotrequired.
Measurementat24hours+/−4hoursaftertestconclusion.
ThermalShock
MIL–STD–202Method
107
−55°C/+125°C.Note:Numberofcyclesrequired–300.Maximumtransfertime–20
seconds. Dwell time – 15 minutes. Air – Air.
HighTemperatureLife
MIL–STD–202Method
108
/EIA–198
1,000hoursat85°Cwith2Xratedvoltageappliedexcludingthefollowing:
Case Size Capacitance Applied Voltage
0402 ≥0.22µF
1.5 X
0603 ≥1.0µF
0805 ≥4.7µF
1206 ≥2.2µF
1210 ≥10µF
StorageLife
MIL–STD–202Method
108
150°C,0VDCfor1,000hours.
Vibration
MIL–STD–202Method
204
5g'sfor20minutes,12cycleseachof3orientations.Note:Use8"X5"PCB0.031"thick
7securepointsononelongsideand2securepointsatcornersofoppositesides.Parts
mountedwithin2"fromanysecurepoint.Testfrom10–2,000Hz
MechanicalShock
MIL–STD–202Method
213
Figure1ofMethod213,ConditionF.
Resistance to Solvents
MIL–STD–202Method
215
Addaqueouswashchemical,OKEMCleanorequivalent.
Storage and Handling
Ceramicchipcapacitorsshouldbestoredinnormalworkingenvironments.Whilethechipsthemselvesarequiterobustin
otherenvironments,solderabilitywillbedegradedbyexposuretohightemperatures,highhumidity,corrosiveatmospheres,
andlongtermstorage.Inaddition,packagingmaterialswillbedegradedbyhightemperature–reelsmaysoftenorwarp
andtapepeelforcemayincrease.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40ºCandmaximum
storagehumiditynotexceed70%relativehumidity.Temperatureuctuationsshouldbeminimizedtoavoidcondensationon
thepartsandatmospheresshouldbefreeofchlorineandsulfurbearingcompounds.Foroptimizedsolderabilitychipstock
shouldbeusedpromptly,preferablywithin1.5yearsofreceipt.