Datasheet

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1069_C0G_HV_HT_200C • 8/10/2016 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Table 2B – Bulk Packaging Quantities
Packaging Type
Loose Packaging Secure Packaging
Bulk Bag (default) 2” x 2” Wafe Pack/Tray
3
Packaging C-Spec
1
N/A
2
7282/7292
Case Size
Chip Thickness
(mm)
Packaging Quantities (pieces/unit packaging)
EIA (in) Metric (mm) Minimum Maximum Minimum Maximum
0402
1005
All
1
50,000
1
368
0603
1608
368
0805
2012
100
1206
3216
≤ 1.25 (nominal)
126
1206
3216
> 1.25 (nominal)
50
1210
3225
All
80
1808
4520
20,000
50
1812
4532
42
1825
4564
20
2220
5650
20
2225
5664
20
1
The "Packaging C-Spec" is a 4-digit code which identies the packaging type. When ordering, the proper code must be included in the 15th through
18th character positions of the ordering code. See "Ordering Information" section of this document for further details. Product ordered without a
packaging C-Spec will default to our standard "Bulk Bag" packaging.
2
A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag). The 15th through 18th character
positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging.
3
Also commonly referred to as “Chip Carrier” or “Molded Tray”. All tray packaging options offer static protection.