Datasheet

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Product Qualication Test Plan

Reliability/Environmental Tests per MIL–STD–202//JESD22

Load Humidity 85°C/85%RH and 200 VDC maximum, 1,000 Hours

Low Voltage Humidity 85°C/85%RH, 1.5V, 1,000 Hours

Temperature Cycling −55°C to +200°C, 50 Cycles

Thermal Shock −55°C to +150°C, 20 seconds transfer, 15 minute dwell, 300 Cycles

Moisture Resistance Cycled Temp/RH 0 V, 10 cycles at 24 hours each

Physical, Mechanical & Process Tests per MIL–STD 202/JIS–C–6429

Resistance to Solvents Include Aqueous wash chemical – OKEM Clean or equivalent

Mechanical Shock and Vibration Method 213: Figure 1, Condition F Method 204: 5 gs for 20 minutes, 12 cycles

Resistance to Soldering Heat Condition B, no per-heat of samples, Single Wave Solder

Terminal Strength Force of 1.8 kg for 60 seconds

Board Flex Appendix 2, Note: 3.0 mm (minimum)

Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in

other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,

and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp

and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum

storage humidity not exceed 70% relative humidity. In addition, temperature uctuations should be minimized to avoid

condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized

solderability chip stock should be used promptly, preferably within the time frame outlined in the table below:

Termination Finish Termination Finish Ordering Code

Storage Life

100% Matte Tin (Sn) C 1.5 years upon receipt

SnPb (5% Pb min.) L 1.5 years upon receipt

Gold (Au) 1.97 – 11.8 µin

E 6 months upon receipt

Gold (Au) 30 – 50 µin F 1.5 years upon receipt

Gold (Au) 100 µin min. G 1.5 years upon receipt

The fourteenth (14th) character position of the KEMET part number is assigned to identify and/or dene the termination nish.

For more information, see “Ordering Information” section of this document.

Gold plating option “E” devices should remain in its factory sealed moisture sensitive packaging during storage. If the factory sealed packaging is

disturbed please store any remaining packaged components in a dry box container to prevent oxidation of the termination nish.