Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Overview KEMET’s High Voltage-High Temperature (HV-HT) series surface mount C0G Multilayer Ceramic Capacitors (MLCCs) are constructed of a robust and proprietary base metal electrode (BME) dielectric system that offers industryleading performance at extreme temperatures.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Packaging C-Spec Ordering Options Table Termination Finish Options Packaging Type/Options Packaging Ordering Code (C-Spec) Standard Packaging – Unmarked3 Bulk Bag Waffle Tray 2 7" Tape & Reel C = 100% Matte Sn L = SnPb (5% Pb min.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Benefits • Operating temperature range of −55°C to +200°C • Lead (Pb)-free, RoHS, and REACH compliant • EIA 0805, 1206, 1210, 1808, 1812, 1825, 2220, 2225, 2824, 3040, 3640, and 4540 case sizes • DC voltage ratings of 500 V, 630 V, 1 KV, 1.5 KV, and 2 KV • Capacitance offerings ranging from 1 pF to 0.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Dimensions – Millimeters (Inches) L W B T S EIA Size Code Metric Size Code 0805 2012 1206 3216 1210 3225 1808 4520 1812 4532 1825 4564 2220 5650 2225 5664 2824 7260 3040 7610 3640 9210 4540 - L Length W Width 2.00 (0.079) ±0.20 (0.008) 3.20 (0.126) ±0.20 (0.008) 3.20 (0.126) ±0.20 (0.008) 4.70 (0.185) ±0.50 (0.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC) Aging Rate (Maximum % Capacitance Loss/Decade Hour) Dielectric Withstanding Voltage (DWV) 1 2 3 Dissipation Factor (DF) Maximum Limit at 25ºC Insulation Resistance (IR) Minimu
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Table 1A – Capacitance Range/Selection Waterfall (0805 – 1808 Case Sizes) Case Size/Series C0805H 1000 1500 2000 LB LB LB LB LB LB LB LB LB LB LB LA LA LA LA LA LA LA LA LA LA LA LA LA LB LB LB LB LB LB LB LB LB LB LC LC LC LC LC LC LA LA LA LA LA LA LB LB LC LC LB LB LB LB LB LB LB LB LB LB LB LA LA LA LA LA LA LA LA LA LA LA LA LA LB LB
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Table 1A – Capacitance Range/Selection Waterfall (0805 – 1808 Case Sizes) cont’d 1500 2000 1500 2000 500 1000 2000 1000 1500 630 1000 630 630 500 G 2000 F 1500 D 1000 B 630 C 500 630 G 500 500 F 2000 1000 D 1500 630 B 2000 Capacitance Cap Code C 1500 512 562 622 682 752 822 G Rated Voltage (VDC) Voltage
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Table 1B – Capacitance Range/Selection Waterfall (1812 – 2225 Case Sizes) 500 630 1000 1500 2000 500 630 1000 1500 2000 2000 2000 GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GH GH GH GH GH GH GK GK GK GK GH GH GH GH GH GH GH GH GK GK GK GK GK GK GK GK GH GH GH GH GH GH GH GH GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GH GH GH GH
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Table 1B – Capacitance Range/Selection Waterfall (1812 – 2225 Case Sizes) cont’d G C B D F Rated Voltage (VDC) 1500 2000 500 630 1000 1500 2000 500 630 1000 1500 2000 C1812H G C B D F JK JK JE JK JK JL JL JL JN JL JN JN JN 1500 F JK JK JE JE JE JE JE JE JK JL JL JN JN 1000 D JK JK JK JK JK JK JE JE JE JE JE JK JL J
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Table 1C – Capacitance Range/Selection Waterfall (2824 – 4540 Case Sizes) 1500 2000 TA TA TA TA TA TA TA TA TA TA TA TA QB QB QB QB QB TA TA TA TA TB QB QB QB QB QB MA MA MA MA MA TA TA TA TB TB QB QB QB QB QB MA MA MA MA MA SA SA SA SA SA TA TA TA TB TC QB QB QB QB QB MA MA MA
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Table 2A – Chip Thickness/Tape & Reel Packaging Quantities Paper Quantity Plastic Quantity Thickness Code Case Size Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel DG ED EF EG FG FL FM FY FK FS LA LB LC GH GK GM GO HE HG HJ HK JE JK JL JN KE KF KH KJ TA TB TC QB QC QD MA MB MC SA SB SC 0805 1206 1206 1206 1210 1210 1210 1210 1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Table 2B – Bulk Packaging Quantities Packaging Type Loose Packaging Secure Packaging Bulk Bag (default) 2” x 2” Waffle Pack/Tray3 N/A 2 7282/7292 Packaging C-Spec1 Case Size EIA (in) Chip Thickness (mm) Metric (mm) 0402 0603 0805 1206 1206 1210 1005 1608 2012 3216 3216 3225 1808 1812 1825 2220 2225 4520 4532 4564 5650 5664 Packagin
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 EIA Size Code Metric Size Code 0805 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 2012 1.00 1.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convecti
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Product Qualification Test Plan Reliability/Environmental Tests per MIL–STD–202//JESD22 Load Humidity Low Voltage Humidity Temperature Cycling Thermal Shock Moisture Resistance 85°C/85%RH and 200 VDC maximum, 1,000 Hours 85°C/85%RH, 1.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Construction (Typical) Detailed Cross Section Termination Finish: C = 100% Matte Sn L = SnPb - 5% Pb min E = Gold (Au) 1.97 - 11.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12, 16 and 24 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 Po ØDo [10 pitches cumulative tolerance on tape ± 0.2 mm] E1 Ao F Ko B1 E2 Bo S1 W P1 T1 Center Lines of Cavity ØD Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions T Po ØDo [10 pitches cumulative tolerance on tape ± 0.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 Newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf) 24 mm 0.1 to 1.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Figure 6 – Reel Dimensions Full Radius, See Note W3 (Includes flange distortion at outer edge) Access Hole at Slot Location (Ø 40 mm minimum) W2 D A (See Note) N C (Arbor hole diameter) B (see Note) (Measured at hub) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Carrier Tape Punched Carrier 8 mm & 12 mm only END Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm Minimum Components 100 mm Minimum Leader 400 mm Minimum Top Cover Tape Figure 8 – Maximum Camber Elongated sprocket holes
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Waffle Tray Packaging Information – 2" x 2" w/ Static Protection Figure 9 – Waffle Tray Dimensions – Inches (Millimeters) M 0.10 (2.54) X 45° M3 M1 Y M2 X X A Z 0.156 +0.002/-0.003 (3.962 +0.051/-0.076) 0.098 (2.489) 0.086 (2.184) 2.000 ±0.004 SQ (50.800 ±0.102 SQ) 90° 0.004 (0.102) 1.800 ±0.004 SQ (45.720 ±0.102 SQ) 1.812 ±0.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) Table 9A – Waffle Tray Dimensions – Inches Case Size EIA (in) 0402 0504 0603 0805 1005 12061,2 12061,3 1210 1808 1812 1825 2220 2225 Metric (mm) 1005 1210 1608 2012 2512 3216 3216 3225 4520 4532 4564 5650 5664 2" x 2" Waffle Tray Dimensions – Inches M ±0.003 0.175 0.235 0.175 0.232 0.230 0.194 0.250 0.217 0.271 0.271 0.318 0.318 0.318 M1 ±0.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade) KEMET Electronic Corporation Sales Offices For a complete list of our global sales offices, please visit www.kemet.com/sales. Disclaimer All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change.