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Overview

KEMET’s Ceramic Chip Capacitor Array in C0G dielectric is an

advanced passive technology where multiple capacitor elements

are integrated into one common monolithic structure. Array

technology promotes reduced placement costs and increased

throughput. This is achieved by alternatively placing one device

rather than two or four discrete devices. Use of capacitor arrays

also saves board space which translates into increased board

density and more functions per board. Arrays consume only

a portion of the space required for standard chips resulting in

savings in inventory and pick/place machine positions.

For added reliability, KEMET's Flexible Termination technology

has been incorporated in order to provides superior ex

performance. This technology was developed to address ex

cracks, which are the primary failure mode of MLCCs and

typically the result of excessive tensile and shear stresses

produced during board exure and thermal cycling. Flexible

Termination technology inhibits the transfer of board stress to the

rigid body of the MLCC, therefore mitigating ex cracks which can

result in low IR or short circuit failures.

KEMET’s C0G dielectric features a 125°C maximum operating

temperature and is considered “stable. "The Electronics Industries

Alliance (EIA) characterizes C0G dielectric as a Class I material.

Components of this classication are temperature compensating

and are suited for resonant circuit applications or those where

Q and stability of capacitance characteristics are required.

C0G exhibits no change in capacitance with respect to time

and voltage and boasts a negligible change in capacitance with

reference to ambient temperature. Capacitance change is limited

to ±30 ppm/ºC from −55°C to +125°C.

KEMET automotive grade array capacitors meet the demanding

Automotive Electronics Council's AEC-Q200 qualication

requirements.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Capacitor Array, C0G Dielectric, 10 – 200 VDC

(Commercial & Automotive Grade)

Ordering Information

CA 06

104 K 4 G A

C TU

Ceramic

Array

Case Size

(L" x W")

Number of

Capacitors

Specication/

Series

Capacitance

Code (pF)

Capacitance

Tolerance

Rated Voltage

(VDC)

Dielectric

Failure Rate/

Design

Termination

Finish

Packaging/Grade

(C-Spec)

05 = 0508

06 = 0612

2 = 2

4 = 4

X = Flexible

Termination

Two

signicant

digits +

number of

zeros

J = ±5%

K = ±10%

M = ±20%

8 = 10

4 = 16

3 = 25

5 = 50

1 = 100

2 = 200

G =

C0G

A = N/A C = 100%

Matte Sn

L = SnPb

(5% minimum

Pb content)

See "Packaging

C-Spec Ordering

Options Table" below

All previous reference to metric case dimension "1632" has been replaced with an inch standard reference of "0612". Please reference all new designs using the

"0612" nomenclature. "CA064" replaces "C1632" in the ordering code.

Additional termination nish options may be available. Contact KEMET for details.

SnPb termination nish option is not available on automotive grade product.

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Summary of content (19 pages)

PAGE 1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Overview KEMET’s Ceramic Chip Capacitor Array in C0G dielectric is an advanced passive technology where multiple capacitor elements are integrated into one common monolithic structure. Array technology promotes reduced placement costs and increased throughput. This is achieved by alternatively placing one device rather than two or four discrete devices.
PAGE 2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Packaging C-Spec Ordering Options Table Packaging/Grade Ordering Code (C-Spec) Packaging Type Commercial Grade1 Bulk Bag 7" Reel/Unmarked 13" Reel (Embossed Plastic Tape) / Unmarked Not Required (Blank) TU 7210 Automotive Grade2 7" Reel 13" Reel/Embossed Plastic/Unmarked AUTO AUTO7210 Default packaging is "Bulk Bag".
PAGE 3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Automotive C-Spec Information KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components.
PAGE 4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Dimensions – Millimeters (Inches) 0508 (2-CAP) 0612 (4-CAP) Top View L BW T CL P Ref T BL W P EIA Size Code Metric Size Code L Length W Width BW Bandwidth BL Bandlength 0508 1220 1.30 (0.051) ±0.15 (0.006) 2.10 (0.083) ±0.15 (0.006) 0.53 (0.021) ±0.08 (0.003) 0.30 (0.012) ±0.20 (0.008) 1632 1.60 (0.063) ±0.20 (0.008) 3.20 (0.126) ±0.20 (0.
PAGE 5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC) Aging Rate (Maximum % Capacitance Loss/Decade Hour) Dielectric Withstanding Voltage (DWV) 1 2 Dissipation Factor (DF) Maximum Limit @ 25ºC 3 Insulation Resistance (IR) Limit @ 25°C −55°C to +125°C ±30
PAGE 6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Table 1 – Capacitance Range/Selection Waterfall (0508 – 0612 Case Sizes) Case Size/Series Capacitance Capacitance Code C0508X (CA052X 2-Cap Case Size) Voltage Code 8 4 3 5 1 8 4 3 5 1 2 Rated Voltage (VDC) 10 16 25 50 100 10 16 25 50 100 200 Capacitance Tolerance 10 pF 12 pF 15 pF 18 pF 22 pF 27 pF 33 pF 39 pF 47 pF 56 pF 68 pF 82 pF 100 pF 1
PAGE 7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Table 2A – Chip Thickness/Tape & Reel Packaging Quantities Paper Quantity Plastic Quantity Thickness Code Case Size Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel PA MA 0508 0612 0.80 ± 0.10 0.80 ± 0.10 0 0 0 0 4,000 4,000 10,000 10,000 Package quantity based on finished chip thickness specifications.
PAGE 8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Table 3 – Chip Capacitor Array Land Pattern Design Recommendations per IPC-7351 EIA SIZE CODE METRIC SIZE CODE Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X P V1 V2 C Y X P V1 V2 C Y X P V1 V2 0508/CA052 1220 1.60 1.00 0.
PAGE 9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Soldering Process Recommended Soldering Technique: • Solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress.
PAGE 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds. Board Flex JIS–C–6429 Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G. Flexible termination system – 3.0 mm (minimum).
PAGE 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Construction Detailed Cross Section Inner Electrodes (Ni) Termination Finish (100% Matte Sn / SnPb - 5% Pb min) Barrier Layer (Ni) Epoxy Layer (Ag) End Termination/ External Electrode (Cu) Dielectric Material End Termination/ External Electrode (CaZrO3) (Cu) Epoxy Layer (Ag) Barrier Layer (Ni) Termination Finish (100% Matte Sn / SnPb - 5% Pb min) Inner Electrodes
PAGE 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips.
PAGE 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØDo [10 pitches cumulative tolerance on tape ± 0.2 mm] Po E1 Ao F Ko B1 E2 Bo S1 W P1 T1 Center Lines of Cavity ØD 1 Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o.
PAGE 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions P2 T Po ØDo [10 pitches cumulative tolerance on tape ± 0.
PAGE 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 Newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.
PAGE 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Figure 6 – Reel Dimensions Full Radius, See Note W3 (Includes Access Hole at Slot Location (Ø 40 mm minimum) flange distortion at outer edge) W2 (Measured at hub) D A (See Note) N C (Arbor hole diameter) B (see Note) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.
PAGE 17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Carrier Tape Punched Carrier 8 mm & 12 mm only END Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm Minimum Components 100 mm Minimum Leader 400 mm Minimum Top Cover Tape Figure 8 – Maximum Camber Elongated sprocket holes (32 mm & wider tapes)
PAGE 18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) KEMET Corporation World Headquarters Europe Asia Southern Europe Sasso Marconi, Italy Tel: 39-051-939111 Northeast Asia Hong Kong Tel: 852-2305-1168 Mailing Address: P.O. Box 5928 Greenville, SC 29606 Skopje, Macedonia Tel: 389-2-55-14-623 Shenzhen, China Tel: 86-755-2518-1306 www.kemet.
PAGE 19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade) Disclaimer All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.