Datasheet

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com C1016_C0G_ARRAY_SMD • 2/29/2016 77
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Capacitor Array, C0G Dielectric, 10 – 200 VDC, (Commercial & Automotive Grade)
Table 2A – Chip Thickness/Tape & Reel Packaging Quantities
Thickness
Code
Case
Size
Thickness ±
Range (mm)
Paper Quantity Plastic Quantity
7" Reel 13" Reel 7" Reel 13" Reel
PA
0508
0.80 ± 0.10
0
0
4,000
10,000
MA
0612
0.80 ± 0.10
0
0
4,000
10,000
Package quantity based on nished chip thickness specications.
Table 2B – Bulk Packaging Quantities
Packaging Type
Loose Packaging
Bulk Bag (default)
Packaging C-Spec
1
N/A
2
Case Size
Packaging Quantities (pieces/unit packaging)
EIA (in) Metric (mm) Minimum Maximum
0402
1005
1
50,000
0603
1608
0805
2012
1206
3216
1210
3225
1808
4520
20,000
1812
4532
1825
4564
2220
5650
2225
5664
1
The "Packaging C-Spec" is a 4 to 8 digit code which identies the packaging type and/or product grade. When ordering, the proper code must be included in the 15th
through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details. Commercial Grade product ordered without
a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk bag packaging option for Automotive Grade products.
2
A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The 15th through
22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to out standard "Bulk Bag" packaging.