Datasheet

ManualsBrandsKEMET ManualsCapacitors4 Ceramic Capacitor Array, 10nF, 200V, 10%

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Overview

KEMET’s Ceramic Chip Capacitor Array in X7R dielectric is

an advanced passive technology where multiple capacitor

elements are integrated into one common monolithic

structure. Array technology promotes reduced placement

costs and increased throughput. This is achieved by

alternatively placing one device rather than two or four

discrete devices. Use of capacitor arrays also saves board

space, which translates into increased board density and

more functions per board. Arrays consume only a portion

of the space required for standard chips resulting in

savings in inventory and pick/place machine positions.

For added reliability, KEMET's Flexible Termination

technology has been incorporated in order to provides

superior ex performance. This technology was developed

to address ex cracks, which are the primary failure mode

of MLCCs and typically the result of excessive tensile

and shear stresses produced during board exure and

thermal cycling. Flexible Termination technology inhibits

the transfer of board stress to the rigid body of the MLCC,

therefore mitigating ex cracks which can result in low IR

or short circuit failures.

KEMET’s X7R dielectric features a 125°C maximum operating

temperature and is considered “temperature stable.”

The Electronics Industries Alliance (EIA) characterizes

X7R dielectric as a Class II material. Components of this

classication are xed, ceramic dielectric capacitors suited

for bypass and decoupling applications, or for frequency

discriminating circuits where Q and stability of capacitance

characteristics are not critical. X7R exhibits a predictable

change in capacitance with respect to time and voltage and

boasts a minimal change in capacitance with reference to

ambient temperature. Capacitance change is limited to ±15%

from −55°C to +125°C.

KEMET automotive grade array capacitors meet the

demanding Automotive Electronics Council's AEC-Q200

qualication requirements.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Capacitor Array, X7R Dielectric, 10 – 200 VDC

(Commercial & Automotive Grade)

Ordering Information

CA 06 4 X 104 K 4 R A C TU

Ceramic

Array

Case Size

(L" x W")

Number of

Capacitors

Specication/

Series

Capacitance

Code (pF)

Capacitance

Tolerance

Rated

Voltage

(VDC)

Dielectric

Failure

Rate/

Design

Termination Finish

Packaging/

Grade (C-Spec)

06 = 0612 4 = 4 X = Flexible

Termination

Two

signicant

digits and

number of

zeros

J = ±5%

K = ±10%

M = ±20%

8 = 10

4 = 16

3 = 25

5 = 50

1 = 100

2 = 200

R = X7R A = N/A C = 100% Matte Sn

L = SnPb

(5% minimum Pb

content)

See

"Packaging

C-Spec

Ordering

Options Table"

All previous reference to metric case dimension "1632" has been replaced with an inch standard reference of "0612". Please reference all new designs

using the "0612" nomenclature. "CA064" replaces "C1632" in the ordering code.

Additional termination nish options may be available. Contact KEMET for details.

SnPb termination nish option is not available on automotive grade product.

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Summary of content (19 pages)

PAGE 1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Overview KEMET’s Ceramic Chip Capacitor Array in X7R dielectric is an advanced passive technology where multiple capacitor elements are integrated into one common monolithic structure. Array technology promotes reduced placement costs and increased throughput. This is achieved by alternatively placing one device rather than two or four discrete devices.
PAGE 2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Packaging C-Spec Ordering Options Table Packaging/Grade Ordering Code (C-Spec) Packaging Type Commercial Grade1 Bulk Bag 7" Reel/Unmarked 13" Reel/Unmarked Not Required (Blank) TU 7210 Automotive Grade2 7" Reel 13" Reel/Unmarked AUTO AUTO7210 Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.
PAGE 3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Automotive C-Spec Information KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components.
PAGE 4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Dimensions – Millimeters (Inches) 0612 (4-CAP) Top View Profile View BW P L T P Ref W BL CL EIA Size Code Metric Size Code L Length W Width BW Bandwidth BL Bandlength T Thickness 0612 1632 1.60 (0.063) ±0.20 (0.008) 3.20 (0.126) ±0.20 (0.008) 0.40 (0.016) ±0.20 (0.008) 0.30 (0.012) See Table 2 for ±0.20 (0.008) Thickness P Pitch P Reference 0.
PAGE 5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range −55°C to +125°C Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC) ±15% Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.
PAGE 6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Table 1 – Capacitance Range/Selection Waterfall (0612 Case Size) C0612C/X (CA064C/X 4-Cap Case Size) Case Size/Series Capacitance Capacitance Code 330 pF 390 pF 470 pF 560 pF 680 pF 820 pF 1,000 pF 1,200 pF 1,500 pF 1,800 pF 2,200 pF 2,700 pF 3,300 pF 3,900 pF 4,700 pF 5,600 pF 6,800 pF 8,200 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 39
PAGE 7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Table 2 – Chip Thickness/Tape & Reel Packaging Quantities Paper Quantity Plastic Quantity Thickness Code Case Size Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel MA 0612 0.80 ±0.10 4,000 10,000 0 0 Package quantity based on finished chip thickness specifications.
PAGE 8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Soldering Process Recommended Soldering Technique: • Solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress.
PAGE 9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds. Board Flex JIS–C–6429 Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G. Flexible termination system – 3.0 mm (minimum).
PAGE 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Construction Detailed Cross Section Inner Electrodes (Ni) Termination Finish (100% Matte Sn / SnPb - 5% Pb min) Barrier Layer (Ni) Epoxy Layer (Ag) End Termination/ External Electrode (Cu) End Termination/ Dielectric Material (CaZrO3) External Electrode (Cu) Epoxy Layer (Ag) Barrier Layer (Ni) Termination Finish (100% Matte Sn / SnPb - 5% Pb min) Inner Electrodes (
PAGE 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Capacitor Marking (Optional): These surface mount multilayer ceramic capacitors are normally supplied unmarked. If required, they can be marked as an extra cost option. Marking is available on most KEMET devices, but must be requested using the correct ordering code identifier(s).
PAGE 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Capacitor Marking (Optional) cont’d Capacitance (pF) For Various Alpha/Numeral Identifiers Numeral Alpha Character 9 A 0.10 1.0 10 100 1,000 10,000 B 0.11 1.1 11 110 1,100 11,000 C 0.12 1.2 12 120 1,200 12,000 D 0.13 1.3 13 130 1,300 E 0.15 1.
PAGE 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips.
PAGE 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØD0 (10 pitches cumulative tolerance on tape ±0.2 mm) P0 A0 E1 F K0 B1 E2 B0 S1 W P1 T1 Center Lines of Cavity ØD1 Cover Tape B1 is for tape feeder reference only, including draft concentric about B0.
PAGE 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions T Po ØDo (10 pitches cumulative tolerance on tape ±0.
PAGE 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.
PAGE 17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Figure 6 – Reel Dimensions Full Radius, See Note W3 (Includes flange distortion at outer edge) Access Hole at Slot Location (Ø 40 mm minimum) W2 D A (See Note) N C (Arbor hole diameter) B (see Note) (Measured at hub) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.
PAGE 18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) Figure 7 – Tape Leader & Trailer Dimensions Punched Carrier 8 mm & 12 mm only END Carrier Tape Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm minimum Components 100 mm minimum leader 400 mm minimum Top Cover Tape Figure 8 – Maximum Camber Elongated Sprocket Holes (32 mm & wider tapes) Carrier Tape Round
PAGE 19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade) KEMET Electronics Corporation Sales Oﬃces For a complete list of our global sales oﬃces, please visit www.kemet.com/sales. Disclaimer All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change.