Datasheet
8© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1017_X7R_ARRAY_SMD • 12/5/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Capacitor Array, X7R Dielectric, 10 – 200 VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique:
• Solder reow only
Recommended Reow Soldering Prole:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. KEMET’s recommended prole conditions for convection and IR reow reect the prole conditions of the IPC/
J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reow passes
at these conditions.
Prole Feature
Termination Finish
SnPb 100% Matte Sn
Preheat/Soak
Temperature Minimum (T
Smin
)
100°C
150°C
Temperature Maximum (T
Smax
) 150°C 200°C
Time (t
S
) from T
Smin
to T
Smax
60 – 120 seconds
60 – 120 seconds
Ramp-Up Rate (T
L
to T
P
)
3°C/second
maximum
3°C/second
maximum
Liquidous Temperature (T
L
) 183°C 217°C
Time Above Liquidous (t
L
) 60 – 150 seconds 60 – 150 seconds
Peak Temperature (T
P
) 235°C 260°C
Time Within 5°C of Maximum
Peak Temperature (t
P
)
20 seconds
maximum
30 seconds
maximum
Ramp-Down Rate (T
P
to T
L
)
6°C/second
maximum
6°C/second
maximum
Time 25°C to Peak
Temperature
6 minutes
maximum
8 minutes
maximum
Note : All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reow.
Time
Temperature
T
smin
25
T
smax
T
L
T
P
Maximum ramp up rate = 3°C/second
Maximum ramp down rate = 6°C/second
t
P
t
L
t
s
25°C to Peak