Datasheet

8© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1100_CAS_SMD • 11/1/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Safety Certied, CAS, Surface Mount X1/Y2 250 VAC, X2 250 VAC (Industrial Grade)
Soldering Process
Recommended Reow Soldering Prole
KEMET’s family of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. KEMET's recommended prole conditions for convection and IR reow reect the prole conditions of the
IPC/J–STD–020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reow
passes at these conditions.
Prole Feature
Termination Finish
100% Matte Sn
Preheat/Soak
Temperature Minimum (T
Smin
)
150°C
Temperature Maximum (T
Smax
) 200°C
Time (t
S
) from T
Smin
to T
Smax
60 – 120 seconds
Ramp-Up Rate (T
L
to T
P
) 3°C/second maximum
Liquidous Temperature (T
L
) 217°C
Time Above Liquidous (t
L
) 60 – 150 seconds
Peak Temperature (T
P
) 260°C
Time Within 5°C of Maximum Peak
Temperature (t
P
)
30 seconds maximum
Ramp-Down Rate (T
P
to T
L
) 6°C/second maximum
Time 25°C to Peak Temperature 8 minutes maximum
Note: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reow.
Time
Temperature
T
smin
25
T
smax
T
L
T
P
Maximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
t
P
t
L
t
s
25°C to Peak