Datasheet
1© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1105_KONNEKT_KC-Link_C0G • 5/20/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
One world. One KEMET
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Eciency,
High-Density Power Applications (Commercial Grade)
Overview
KEMET's KC-LINK™ with KONNEKT™ technology surface
mount capacitors are designed for high-eciency and
high-density power applications. KONNEKT high density
packaging technology uses an innovative Transient Liquid
Phase Sintering (TLPS) material to create a surface
mount multi-chip solution for high density packaging. By
utilizing KEMET's robust and proprietary C0G base metal
electrode (BME) dielectric system, these capacitors are
well suited for power converters, inverters, snubbers, and
resonators where high eciency is a primary concern.
KONNEKT technology enables a low-loss, low-inductance
package capable of handling extremely high ripple
currents with no change in capacitance versus DC voltage
and negligible change in capacitance versus temperature.
With an operating temperature range up to 150°C, these
capacitors can be mounted close to fast switching
semiconductors in high power density applications, which
require minimal cooling. KC-LINK with KONNEKT technology
also exhibits high mechanical robustness compared to
other dielectric technologies, allowing the capacitor to be
mounted without the use of metal frames.
These capacitors can also be mounted in a low-loss
orientation to further increase power handling capability.
The low-loss orientation lowers ESR (Effective Series
Resistance) and ESL (Effective Series Inductance) which
increases ripple current handling capability.
Benets
• Extremely high-power density and ripple current
capability
• Extremely low equivalent series resistance (ESR)
• Extremely low equivalent series inductance (ESL)
• Low-loss orientation option for higher current handling
capability
• Capacitance offerings ranging from 44 nF to 880 nF
• DC voltage ratings from 500 V to 1,700 V
• Operating temperature range of −55°C to +150°C
• No capacitance shift with voltage
• No piezoelectric noise
• High thermal stability
• Surface mountable using standard MLCC reow proles
Applications
• Wide bandgap (WBG), silicon carbide (SiC) and gallium
nitride (GaN) systems
• Data centers
• EV/HEV (drive systems, charging)
• LLC resonant converters
• Switched tank converters
• Wireless charging systems
• Photovoltaic systems
• Power converters
• Inverters
• DC link
• Snubber
Low LossStandard
Lead-free