Datasheet

16© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard A4001_EDK • 4/22/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Aluminum Electrolytic Capacitors – EDK, +85°C
Soldering Process
Thesolderingconditionsshouldbewithinthespeciedconditionsbelow:
Do not dip the capacitor body into the melted solder. Flux should only be applied to the capacitor terminals.
T1Pre-heat
T3
T2
T3
T0
Time (seconds)
Temperature of capacitor terminal (°C)
Vapor heat transfer systems are not recommended. The system should be thermal, such as infra-red radiation or hot blast
Observe the soldering conditions as shown below.
Do not exceed these limits and avoid repeated reowing
Reow Soldering
Temperature (°C)
Maximum Time
(Seconds)
T0 20 – 140 60
Pre-heat 140 – 180 150
T1 180 – 140 100
T2 > 200 60
T3 230 20
Lead-Free Reow Soldering
Temperature (°C)
Maximum Time
(Seconds)
T0 20 – 160 60
Pre-heat 160 – 190 120
T1 190 – 180 90
T2 > 220 60
Lead-Free Reow Soldering cont'd.
T3
Size
Temperature
(°C)
Maximum Time
(Seconds)
Φ4~Φ5(4–50V)
250 10
260 5
Φ6.3~Φ10(4–50V) 250 5
Φ4~Φ10(63–100V) 250 5
T3
Size
Temperature
(°C)
Maximum Time
(Seconds)
Φ4~Φ5
(4 – 50 V)
250 10
260 5
Φ6.3~Φ10
(4 – 50 V)
250 5
Φ4~Φ10
(63 – 100 V)
250 5
≥Φ12.5 250 5